2011
DOI: 10.1016/j.jcrysgro.2010.10.199
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Dislocation dynamics and slip band formation in silicon: In-situ study by X-ray diffraction imaging

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Cited by 31 publications
(29 citation statements)
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“…For a standard (001) oriented Si wafer a 220 reflection is the best choice to achieve high contrast and resolution. The industrial sized wafer metrology was established for Si 300 mm, in about 2 h time, and upgraded to 450 mm Si in about 4.3 h. [75,76,77] In naked dislocation free Si wafers, it is enough to image the edges in a couple of minutes. This is of interest to localize microcracks, which originate from edge grinding or wafer handling and which are invisible by other characterization methods.…”
Section: Full Wafer Mappingmentioning
confidence: 99%
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“…For a standard (001) oriented Si wafer a 220 reflection is the best choice to achieve high contrast and resolution. The industrial sized wafer metrology was established for Si 300 mm, in about 2 h time, and upgraded to 450 mm Si in about 4.3 h. [75,76,77] In naked dislocation free Si wafers, it is enough to image the edges in a couple of minutes. This is of interest to localize microcracks, which originate from edge grinding or wafer handling and which are invisible by other characterization methods.…”
Section: Full Wafer Mappingmentioning
confidence: 99%
“…This sample was specifically prepared in this way to originate dislocation patterns for the 3D diffraction laminography as presented in Section 4. [61,62] Thanks to the in situ experiments a model for thermal slip formation is proposed by Wittge et al [101,102] Figure 6 shows schematically the situation of a (100) wafer with three indents and the perpendicular pairs of {111} glide planes below. Because of the strongest thermal and strain gradient parallel to [011], dislocation half-loops with the Burgers vector ⃗ b = a/2 ⟨110⟩ start as indicated into this direction.…”
Section: Dislocation Dynamics In Sic and Simentioning
confidence: 99%
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“…White-beam X-ray topography (WB-XRT) is widely used for the characterization of both long-range and short-range strain in single crystals [66][67][68][69]. High-resolution X-ray topography (XRT) provided quantitative measurements of misfit dislocation line density [70], together with the monitoring of in situ and real-time nucleation, growth, and movement of dislocations in silicon at high temperatures [71]. In situ XRT using synchrotron radiation during mechanical testing [72] or crystal growth [73] helped to reveal the mechanism of dislocation formation.…”
Section: Microscopic Analysesmentioning
confidence: 99%
“…CDIC microscopy (in the reflection mode) is known to be well suited for the visualization of such height variations [5]. Based on Ref.…”
mentioning
confidence: 99%