2009
DOI: 10.1557/proc-1195-b11-02
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Distribution of Hydrogen- and Vacancy-Related Donor and Acceptor States in Helium-Implanted and Plasma-Hydrogenated Float-Zone Silicon

Abstract: The formation and evolution of hydrogen-and vacancy-related donor and acceptor states were studied in helium-implanted and subsequently hydrogen plasma-treated n-type Float-Zone (FZ) silicon wafers by means of two-point-probe Spreading Resistance (SR) measurements. He +implantation was executed at 3.75 MeV and 11 MeV at fluences of 1×10 14 cm -2 . Post-implantation 13.56-MHz RF-plasma hydrogenations were carried out at 150 W either for 15 min or 1 hour, applying substrate temperatures between 350 °C and 500 °C… Show more

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Cited by 3 publications
(3 citation statements)
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“…In the case of the plasma hydrogenated samples, this oxidation step is omitted. However, the impact of such an oxidation has no significant impact on the formation of the investigated donors, especially in the layer between the surface and the end-of-range region [14]. During implantation, the samples are tilted by 7° from the <100>-direction to avoid channeling effects.…”
Section: Methodsmentioning
confidence: 99%
“…In the case of the plasma hydrogenated samples, this oxidation step is omitted. However, the impact of such an oxidation has no significant impact on the formation of the investigated donors, especially in the layer between the surface and the end-of-range region [14]. During implantation, the samples are tilted by 7° from the <100>-direction to avoid channeling effects.…”
Section: Methodsmentioning
confidence: 99%
“…Post-implantation hydrogen-plasma exposures were carried out with a Radio-Frequency (RF) setup operating at 13.56 MHz standard frequency and providing a plasma power of 150 W. The plasma hydrogenations were executed at various substrate temperatures between 350 °C and 500 °C for either 15 min or 60 min. The temperature profiles applied during the H-plasma exposure were as follows: 1) The samples were heated up to the desired substrate temperature applying a temperature ramp of 100 °C/min; 2) after the temperature had stabilized (within 1 min), the plasma was ignited, and the temperature was kept constant during the whole plasma treatment (± 1 °C); 3) after the plasma exposure was finished, the heater was immediately switched off and the temperature decreased exponentially; 4) after another 1 h -1.5 h, the samples were taken out of the process chamber at temperatures well below 150 °C (for further details see (7,8)).…”
Section: Methodsmentioning
confidence: 99%
“…The actual publication is based on recent investigations, in which two-step processes with successive H + -or He + -implantation and hydrogen-plasma treatment were analyzed. Having applied spreading resistance measurements, the formation and annihilation of ntype and p-type doping profiles in light-ion implanted and plasma-hydrogenated Float FZ silicon samples was investigated (7,8). FZ Si wafers were used for these studies, since they are the standard substrates for power-device applications.…”
Section: Introductionmentioning
confidence: 99%