2009
DOI: 10.1016/j.solmat.2009.04.010
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Doping levels, trap density of states and the performance of co-doped CdTe(As,Cl) photovoltaic devices

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Cited by 48 publications
(28 citation statements)
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“…This was attributed to segregation of As at the grain boundaries, interfaces, back surface or at defects within the CdTe layer. 10,56 This correlated 56 with a decrease in shunt resistance as As concentration was increased from 1 Â 10 17 to 1.5 Â 10 19 atoms cm À3 . Nevertheless, acceptor concentration levels achieved $10 15 cm À3 and, if doping concentrations are optimised, then group V elements such as As and Sb can be used as effective dopants to form p-type CdTe.…”
Section: Extrinsicmentioning
confidence: 80%
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“…This was attributed to segregation of As at the grain boundaries, interfaces, back surface or at defects within the CdTe layer. 10,56 This correlated 56 with a decrease in shunt resistance as As concentration was increased from 1 Â 10 17 to 1.5 Â 10 19 atoms cm À3 . Nevertheless, acceptor concentration levels achieved $10 15 cm À3 and, if doping concentrations are optimised, then group V elements such as As and Sb can be used as effective dopants to form p-type CdTe.…”
Section: Extrinsicmentioning
confidence: 80%
“…Too much dopant material can cause issues by segregating in the grain boundaries along which they diffuse to the junction producing shunting pathways. 4,24,56 Diffusion of Sb has been observed 46,57 to be slower in CdTe than Cu aer stability tests were carried out with assessment of PV degradation in solar cells with different back contact materials.…”
Section: Extrinsicmentioning
confidence: 99%
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“…In order to reduce the bulk recombination and the cost of solar cells manufacturing for optimal performance, a research in n-CdS/p-CdTe thin films has been started [6]. Both CdTe and CdS are quite stable and can be produced using various scalable techniques like Chemical Both Deposition, Close-space sublimation, Molecular Organic Chemical Vase Deposition (MOCVD), Atomic Layer Epitaxy (ALE), screen printing, sputtering, sintering, Molecular Beam Epitaxy (MBE), Electro-deposition (ED) and High Vacuum Evaporation (HVE) [7]- [9].…”
Section: Introductionmentioning
confidence: 99%