Doping of C₆₀ Films Using High Energy Boron Ion Implantation

Abstract

C60 films, which are deposited by partially ionized beam deposition (PIBD), are doped by 100 keV boron ion implantation at dose ranging from 3*1014 to 1*1016 cm2 The implantation process has been studied using Fourier transform infrared spectroscopy (FTIR), Raman spectra and X-ray diffraction (XRD) analyses. Almost all C60 soccer-balls in the doped region in the films are found to be broken at dose of 1*1016 cm2, while at dose less than 6*1014 cm2 a few C60 molecules remain undestroyed and maintain the original structural properties.