Double Mold Antenna in Package for 77 GHz Automotive Radar

Ho, Soon Wee; Boon, Soh Siew; Long, Lau Boon; Hsiao, Hsiang-Yao; Choong, Chong Ser; Siang, Sharon Lim Pei; Guan, Lim Teck; Chong, Chai Tai

doi:10.1109/eptc50525.2020.9315071

Cited by 15 publications

(2 citation statements)

References 2 publications

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“…In this project, TMV interposers were implemented to realize the vertical interconnection. Currently, there are several methods available to prepare TMV for integrated circuit packaging, such as laser etching [26], Cu pillar [27], wire bonding [28], and the imprint method [29]. In [26], the TMV was created by laser etching through the embedding molding compound and then metalized via Cu plating.…”

Section: Process Of Tmv-embedded Fowlpmentioning

confidence: 99%

“…In contrast to the abovementioned methods and other works in the literature [29,30], the TMV interposers were fabricated using a mechanical drilling and electroplating process, which has significant benefits in terms of fewer steps and lower cost. Vias were manufactured using mechanical drilling on a glass fiber board with a thickness of 400 µm.…”

Section: Process Of Tmv-embedded Fowlpmentioning

confidence: 99%

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Ultrathin Antenna-in-Package Based on TMV-Embedded FOWLP for 5G mm-Wave Applications

Yin,

Xia,

Liu

et al. 2024

Electronics

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In this paper, a novel through mold via (TMV)-embedded fan-out wafer-level package (FOWLP) technology was demonstrated to manufacture the well-designed Antenna in Package (AiP) with ultrathin thickness (0.04 λ0). Double-sided redistribution layers (RDLs) were employed to build the patch antenna, while a TMV interposer was used to connect the front and back RDLs. By optimizing the AiP’s parameters, the patch antenna can achieve a wide impedance bandwidth of 17.8% from 24.2 to 28.5 GHz, which can cover the 5G frequency bands. Compared with previous works, the proposed AiP has significant benefits in terms of its ultralow profile, easy processing, and high gain. Hence, the TMV-embedded FOWLP should be a promising technology for fifth generation (5G) millimeter wave (mm-Wave) applications.

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