2014
DOI: 10.1017/s1551929513001260
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Downstream Plasma Technology for Cleaning TEM Samples on Carbon Films

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Cited by 9 publications
(4 citation statements)
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“…Si contamination was also removed to some extent (as shown in Figure 7a), which may be attributed to the aggregation of C and Si on the sample surface. A similar case of decreased Si contamination during plasma cleaning was reported by Fu et al (2014).…”
Section: Resultssupporting
confidence: 83%
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“…Si contamination was also removed to some extent (as shown in Figure 7a), which may be attributed to the aggregation of C and Si on the sample surface. A similar case of decreased Si contamination during plasma cleaning was reported by Fu et al (2014).…”
Section: Resultssupporting
confidence: 83%
“…Compared with some commercial apparatus (such as Gatan 950 and 955, Fischione 1070), the design and assembly of vacuum joints with various components in the proposed apparatus can achieve multiple functions in one setup (as shown in Figures 2 and 4) (Fu et al, 2014; Goh et al, 2020; Hata et al, 2006). The designed holder storage station is suitable for ergonomics, because it can be safely operated in front of the apparatus (Figure 2b).…”
Section: Resultsmentioning
confidence: 99%
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“…For 92 h, the emission of the VES beam was maintained at an accelerating voltage of 12.9 kV and a frequency of 350 kHz. Surface organic contaminations were eliminated by preprocessing treatments using the GV10x plasma cleaning process (ibss Group), which could clean the plasma source of three plasma species (ions, radicals, and electrons) [19,20]. The cleaned sample was introduced to the time-of-flight secondary ion mass spectrometry (TOF-SIMS) chamber (nanoTOF II, ULVAC-PHI).…”
Section: Elemental Imaging Using Time-of-flight Secondary Ion Mass Sp...mentioning
confidence: 99%