Drop feature optimization for fine trace inkjet printing

Mohan, Nihesh; Bhogaraju, Sri Krishna; Łysień, Mateusz; Schneider, L.; Granek, F.; Lux, Kerstin; Elger, Gordon

doi:10.23919/empc53418.2021.9585004

Cited by 5 publications

(5 citation statements)

References 15 publications

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“…The cartridge and platen temperature were set at room temperature (25 °C) and the nozzle voltage varied between 33 and 40 V. The drop spacing (the distance between the center of two adjacent drops) was modified to obtain complete overlap and sufficient coverage of the film. [ 34 ] The optimized drop spacing for all the films prepared for this study was 25 µm. After printing, the films were annealed on a hot plate at 120 °C for 10 min.…”

Section: Methodsmentioning

confidence: 99%

Combination of Counterion Size and Doping Concentration Determines the Electronic and Thermoelectric Properties of Semiconducting Polymers

Baustert,

Bombile,

Rahman

et al. 2024

Advanced Materials

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In both chemical and electrochemical doping of organic semiconductors (OSCs), a counterion, either from the electrolyte or ionized dopant, balances the charge introduced to the OSC. Despite the large influence of this counterion on the OSC optical and electronic response, there remains substantial debate on how a fundamental parameter, ion size, impacts these properties. This work addresses this discrepancy by accounting for two doping regimes. In the low‐doping regime the Coulomb binding energies between polarons on the π‐conjugated polymers and the counterions are significant, and larger counterions lead to decreased Coulomb interactions, more delocalized polarons, and higher electrical conductivities. In the high‐doping regime the Coulomb binding energies become negligible due to the increased dielectric constant of the films and a smoothing of the energy landscape; thereby, the electrical conductivities depend primarily on the extent of morphological disorder in the OSC. Moreover, in regioregular poly(3‐hexylthiophene), rr‐P3HT, smaller counterions lead to greater bipolaron concentrations in the low‐doping regime due to the increased Coulomb interactions. Emphasizing the impact of the counterion size, we show that larger counterions can lead toincreased thermoelectric power factors for rr‐P3HT.This article is protected by copyright. All rights reserved

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Section: Methodsmentioning

confidence: 99%

Combination of Counterion Size and Doping Concentration Determines the Electronic and Thermoelectric Properties of Semiconducting Polymers

Baustert,

Bombile,

Rahman

et al. 2024

Advanced Materials

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“…1a shows a schematic of drop deposition based on ink-substrate interaction, where γT and γE are surface tension of the ink and surface energy of the substrate, respectively. When surface tension of the Cu complex ink is very less than the surface energy of the polyimide substrate, it causes uneven spreading whereas when it is greater it causes droplet formation on the substrate [40]. In this case, the surface tension of the designed Cu complex ink is 35 mN/m and surface energy of the polyimide substrate is 47 mJ/m 2 b [41].…”

Section: A Ink Design and Printabilitymentioning

confidence: 97%

“…2 shows the inkjet printing parameters used in this study. More details related to optimization of printing parameters related to inkjet printing can be found in our previous publications [ ] 40 .…”

Section: A Ink Design and Printabilitymentioning

confidence: 99%

Rapid Sintering of Inkjet Printed Cu Complex Inks Using Laser in Air

Mohan,

Ahuir-Torres,

Bhogaraju

et al. 2024

IMAPSource Proceedings

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Cu complex inks offer a facile and cost-effective alternative to commercial nanoparticle inks for printed electronics application. Cu complex inks are prepared by mixing Cu formate tetrahydrate (metal precursor) with amino-2-propanol (complexing agent) in a molar ratio of 1:2. A carrier solvent consisting of ethanol and ethylene glycol is then added to help adjust the rheological properties of the ink for printing purpose. The Cu complex ink having a viscosity of 12 mPa.s is then inkjet printed onto a polyimide substrate (thickness: 125 μm). After printing 10 layers, the ink is pre-dried under air at 100°C for 5 minutes followed by sintering using an IR laser (942 nm) to enable rapid thermal decomposition of the Cu formate. After sintering using a 100 W line beam laser scanned at 3 mm/sec under air; a contiguous and homogenous Cu metallic trace is formed with a minimum bulk resistivity of 4.8 μΩcm (2.84 times of bulk Cu). The laser sintered trace exhibited a highly compact and homogenous sintered structure after thermal decomposition compared to the conventional oven sintering process. Th result is remarkable and proves the importance of faster decomposition process. In contrast, sintering the same trace using slow ramp rate within the traditional oven sintering pr process, it is observed that a Cu metallic trace is formed with particles in the range of 2-5 μm that are sparsely distributed due to low metal content of Cu complex inks (< 10 metal wt.%). Due to sparse distribution of particles, a low bulk resistivity value of 102 μΩcm is obtained.

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“…The volume of the drop can be controlled by waveform parameters, velocity can be controlled by the jetting voltage and cartridge temperature, and the geometry of the drop can be controlled by the jetting voltage and waveform parameters. 67 Thus, after multiple trials, we finalized the parameters suitable for our printing, as shown in Table 3.…”

Section: Inkjet Printingmentioning

confidence: 99%