Drop impact reliability of Sn–1.0Ag–0.5Cu BGA interconnects with different mounting methods

Wang, Bo; Li, Jiajun; Gallagher, Tony; Wrezel, James; Towashirporn, Pongpinit; Zhao, Naiqin

doi:10.1016/j.microrel.2012.02.001

Cited by 22 publications

(5 citation statements)

References 24 publications

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“…Sn-Ag-Cu lead-free solders are now widely applied in the electronic packaging 39 industry thanks to their excellent mechanical properties, good solderability and low 40 environmental damage [1][2][3]. However, with a continuing trend of miniaturization and 41 high integration in electronics, Sn-Ag-Cu solder joints are more frequently exposed to …”

Section: Introduction 38mentioning

confidence: 99%

Performance of Sn–3.0Ag–0.5Cu composite solder with TiC reinforcement: Physical properties, solderability and microstructural evolution under isothermal ageing

Chen

Peng

Silberschmidt

et al. 2016

Journal of Alloys and Compounds

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Section: Introduction 38mentioning

confidence: 99%

Performance of Sn–3.0Ag–0.5Cu composite solder with TiC reinforcement: Physical properties, solderability and microstructural evolution under isothermal ageing

Chen

Peng

Silberschmidt

et al. 2016

Journal of Alloys and Compounds

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“…In that field, solder joint reliability in term of both drop performance and thermal cycling loading conditions is of great concern for portable electronic products. The most promising one for packaging interconnects in electronic industry appears to be the SneAgeCu (SAC) alloys eutectic or near eutectic alloy system [2,3]. These alloys can offer an excellent combination of better thermo-mechanical properties and wettability compared to PbeSn solders.…”

Section: Introductionmentioning

confidence: 99%

Microstructural modifications and properties of low-Ag-content Sn–Ag–Cu solder joints induced by Zn alloying

El-Daly

El-Hosainy

Elmosalami

et al. 2015

Journal of Alloys and Compounds

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“…The flux formulation has been demonstrated to have a significant impact on the strength of the solder joint. 31 Additionally, bonding of metals with surface oxides that are either thick or of low solubility in common solder fluxes, such as Cu, Ni and Al, can be difficult and may require the use of more aggressive, noxious chemistries or the use of alternative solders. 32,33 Solder fluxes are used in a variety of ways in PCB manufacturing including as a core within the solder wire, in wave soldering and as the flux medium in a solder paste.…”

Section: Dess In Pcb Assembly and Process Control 1031 Solderingmentioning

confidence: 99%

Environmentally Sustainable Solvent-based Process Chemistry for Metals in Printed Circuit Boards

Ryder

Ballantyne

Smith

et al. 2019

Electronic Waste Management

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This chapter describes the development of several new processes relating to the fabrication, characterisation and recycling of printed circuit board (PCB) metal assemblies in alternative, sustainable solvent technologies based on an emergent class of liquids know as deep eutectic solvents (DES). It has been demonstrated that in many cases, the use of DES technologies can be disruptive to current process thinking and in principle can deliver benefits including increased efficiency, lower costs and better process control. These technologies offer the opportunity to incorporate new ideas into PCB fabrication and assembly that facilitate downstream, end-of-life recovery and separation consistent with a circular economy model. Current PCB manufacturing is carried out using many complex metal deposition processes involving aqueous solutions of toxic metal salts, strong inorganic acids, precious and expensive noble metals, and requires careful process control and monitoring. As a result, these processes are often costly to operate and inefficient. DES-based technologies can: (1) improve the economic and efficient use of essential metals; (2) reduce or eliminate use of precious and expensive metals; (3) reduce the use of complex and difficult to maintain process chemistry; (4) reduce reliance on toxic and noxious materials; and (5) improve recovery, recycling and reuse of PCB metals.

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Drop impact reliability of Sn–1.0Ag–0.5Cu BGA interconnects with different mounting methods

Cited by 22 publications

References 24 publications

Performance of Sn–3.0Ag–0.5Cu composite solder with TiC reinforcement: Physical properties, solderability and microstructural evolution under isothermal ageing

Performance of Sn–3.0Ag–0.5Cu composite solder with TiC reinforcement: Physical properties, solderability and microstructural evolution under isothermal ageing

Microstructural modifications and properties of low-Ag-content Sn–Ag–Cu solder joints induced by Zn alloying

Environmentally Sustainable Solvent-based Process Chemistry for Metals in Printed Circuit Boards

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