Performance of Sn–3.0Ag–0.5Cu composite solder with TiC reinforcement: Physical properties, solderability and microstructural evolution under isothermal ageing

Chen, Guang; Peng, Hao; Silberschmidt, Vadim V.; Chan, Y. C.; Liu, Changqing; Wu, Fengshun

doi:10.1016/j.jallcom.2016.05.245

Cited by 67 publications

(28 citation statements)

References 19 publications

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Section: Reliabilitymentioning

confidence: 96%

“…One reason is that the particles can be adsorbed on the surface of IMCs and the other is that the gathering of TiC particles at the interface decreases the concentration gradient of Sn. Consequently, appropriate content of TiC nanoparticles effectively inhibited the growth of Cu6Sn5 and Cu3Sn layers during aging, as shown in Figure 6 [47]. The increasing current density in IC brings a deteriorative electromigration effect and the improvement of EM resistance of solder joints gradually becomes a research focus in reliability research [48,49].…”

Section: Reliabilitymentioning

confidence: 99%

“…Effect of TiC nanoparticles content on the thickness of IMCs layers during aging (a) Cu6Sn5; (b) Cu3Sn[47].…”

mentioning

confidence: 99%

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Effect of Nanoparticles Addition on the Microstructure and Properties of Lead-Free Solders: A Review

et al. 2019

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With the development of microelectronic packaging and increasingly specific service environment of solder joints, much stricter requirements have been placed on the properties of lead-free solders. On account of small size effect and high surface energy, nanoparticles have been widely used to improve the microstructure and properties of lead-free solders. Therefore, the composite solders bearing nanoparticles have recently attracted wide attention. This article reviewed the recent research on SnAgCu, SnBi, and SnZn composite solder alloys and introduced the effect of nanoparticles on their microstructure, mechanical properties, wettability, and reliability. The mechanism of nanoparticles strengthening was analyzed and summarized. In addition, the shortcomings and future development trends of nanoparticle-reinforced lead-free solders were discussed, which is expected to provide some theoretical reference for the application of these composite solder in 3D IC package.

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Section: Reliabilitymentioning

confidence: 96%

Section: Reliabilitymentioning

confidence: 99%

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Effect of Nanoparticles Addition on the Microstructure and Properties of Lead-Free Solders: A Review

et al. 2019

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“…e phenomenon could be attributed to the reduced surface tensions of the molten solder in the presence of ZnO nanoparticles in which the liquid-solid and liquid-vapor surface tensions decreased [34]. Meanwhile, the higher nano-ZnO concentrations elevated the viscosity of the molten solder, resulting in the upsurge in the contact angle [35][36][37][38]. e nding suggested that the solder contact angles could be manipulated by varying the nano-ZnO concentrations.…”

Section: Wettability On the Copper Substratementioning

confidence: 99%

Effects of Zinc Oxide Nanoparticles on Properties of SAC0307 Lead‐Free Solder Paste

Kanlayasiri

Meesathien

2018

Advances in Materials Science and Engineering

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is research investigates the effects of zinc oxide (ZnO) nanoparticles of varying concentrations 0.0, 0.25, 0.50, 0.75, and 1.0 wt.% on the melting temperatures, wettability, printability, slump, and interfacial microstructure of the ZnO-doped Sn-0.3Ag-0.7Cu lead-free solder pastes on the copper substrate. e results revealed that the introduction of the ZnO particles had no effect on the solidus and liquidus temperatures of the solders. e maximum wettability was achieved with 0.25 wt.% ZnO nanoparticles, while the printability was inversely correlated with the nano-ZnO concentrations. e findings also indicated that, at room temperature, the slumping and the nano-ZnO concentrations were positively correlated and that, under the 150°C thermal condition, the maximum slumping was achieved with 0.25 wt.% ZnO. e slumping mechanism of the SAC0307-xZnO solder pastes is also provided herein. Moreover, the experiments showed that Cu 6 Sn 5 was the single intermetallic compound present in the interfacial layer between the solders and the copper substrate, with the maximum intermetallic layer thickness realized at the 0.25 wt.% ZnO concentration.

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“…Numerous studies are dedicated to the development of nanocomposites. e.g., the composites with nanosized reinforcing particles [3][4][5][6]. Nano-powders exhibit a number of features, such as developed surface and high activity of the material, which result in any amount of foreign matter and contamination on the surface of nanoparticles.…”

Section: Introductionmentioning

confidence: 99%

Application of nanodiamonds for in situ synthesis of TiC reinforcing nanoparticles inside aluminium matrix during mechanical alloying

Попов

Шелехов

Prosviryakov

et al. 2017

Diamond and Related Materials

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Performance of Sn–3.0Ag–0.5Cu composite solder with TiC reinforcement: Physical properties, solderability and microstructural evolution under isothermal ageing

Cited by 67 publications

References 19 publications

Effect of Nanoparticles Addition on the Microstructure and Properties of Lead-Free Solders: A Review

Effect of Nanoparticles Addition on the Microstructure and Properties of Lead-Free Solders: A Review

Effects of Zinc Oxide Nanoparticles on Properties of SAC0307 Lead‐Free Solder Paste

Application of nanodiamonds for in situ synthesis of TiC reinforcing nanoparticles inside aluminium matrix during mechanical alloying

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