Dropping Simulation of Printed Circuit Board with BGA Soldering Assembly for Optical Module Application

Wang, Shouxu; Chen, Yunzhao; Li, Zheng; Chen, Yuanming; Zhang, Huaiwu; Gong, Lijun; Chen, Bei; He, Wei

doi:10.2991/msota-16.2016.107

Cited by 1 publication

(3 citation statements)

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“…All these variables need to be taken into account when creating an FEM of a PCB, regardless of the type of study that is being conducted. There are many authors modelling PCBs as a full single material body [2,[5][6][7][8]10,12,13,17,18,20,21]; however, to obtain more accurate results, some researchers According to the referential in Figure 6, sensor 1 measures the strain in the Y direction and sensors 2 and 3 measure the strain in the X direction. It is possible to observe that sensor 1 is located above a region of the PCB where there are copper traces perpendicular to the sensor measurement direction in the third layer.…”

Section: Finite Elements Analysismentioning

confidence: 99%

Section: Finite Elements Analysismentioning

confidence: 99%

“…The greatest number of works have resorted to three-and four-point bending tests, and are addressed to the packages' solder joints reliability and their main failure mechanisms [2][3][4][5][6][7][8][9][10][11]. There are also studies using drop-impact tests to understand the PCBs' dynamic bending effects on solder joint behaviour [12,13]. Furthermore, there are some analyses regarding the effects of thermal bending on solder joints [14][15][16].…”

Section: Introductionmentioning

confidence: 99%

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A Systematic Analysis of Printed Circuit Boards Bending during In-Circuit Tests

et al. 2022

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When performing In-Circuit Tests (ICTs) of Printed Circuit Boards (PCBs), there are certain phenomena related with strain analysis that must be known in order to obtain stronger and more accurate testing results. During testing, PCBs are often subjected to mechanical bending efforts that induce excessive strain. This study focuses on the building of a Finite Elements Analysis (FEA) methodology that prevents excessive bending strain in critical points of a PCB during an ICT. To validate this methodology, a set of experimental tests, matched with a set of FEA, were carried out. Thus, companies, before the development of an ICT machine (fixture), will be able to use this FEA methodology to predict whether the maximum strain of a PCB under study, when subjected to its ICT, will damage it, thus reducing unnecessary production costs. A guideline was thus designed to enable the creation of the most representative Finite Elements Model (FEM) for any PCB, based on its amount and direction of copper traces.

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