2019
DOI: 10.3390/s19245383
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Dry Coupling of Ultrasonic Transducer Components for High Temperature Applications

Abstract: The viability for dry coupling of piezoelectric ultrasonic transducer components was investigated, using a thin foil of annealed silver as a filler material/coupling agent at each component interface. Criteria used for room temperature evaluation were centered on signal-to-noise ratio (SNR) and echo bandwidth, for a Li-Nb based transducer operating in pulse-echo mode. A normal clamping stress of only 25 MPa, applied repeatedly over three loading cycles on a precisely-aligned transducer stack, was sufficient to… Show more

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Cited by 20 publications
(13 citation statements)
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“…In order to avoid this problem Bhadwal et al proposed the transducer in which a spring is used to keep a constant pressure between transducer elements in a wide temperature range. The acoustic contact is obtained due to use of soft foils coupling all parts of the spring-loaded transducer at the pressure of only 25 MPa [ 32 ]. Such coupling enabled getting a good signal to noise ratio.…”
Section: Bonding Methodsmentioning
confidence: 99%
See 2 more Smart Citations
“…In order to avoid this problem Bhadwal et al proposed the transducer in which a spring is used to keep a constant pressure between transducer elements in a wide temperature range. The acoustic contact is obtained due to use of soft foils coupling all parts of the spring-loaded transducer at the pressure of only 25 MPa [ 32 ]. Such coupling enabled getting a good signal to noise ratio.…”
Section: Bonding Methodsmentioning
confidence: 99%
“…Therefore, between bonded surfaces a thin ductile metallic foil is inserted that partially compensates stresses caused by variations of temperature due to different thermal expansion coefficients. For such a purpose, Bhadwal et al proposed to use an annealed 50 mm thickness silver foil [ 32 ]. We have proposed to use a soft gold foil with a purity of 99.99% with a thickness 5–20 μm, which is more expensive than the silver foil, but it is more ductile [ 124 , 125 ].…”
Section: Bonding Methodsmentioning
confidence: 99%
See 1 more Smart Citation
“…The second paper by Bhadwal et al [2] investigates the problem of coupling together the various components of an ultrasonic transducer that would undergo excursions to temperatures as high as 700 • C. Due to the differential thermal expansion of the piezoelement, backing layer, and wear plate, solid coupling techniques such as brazing would lead to cracking or even total transducer failure. The authors evaluated the feasibility of using dry coupling, but at far lower clamping loads than the 200-500 MPA interfacial pressure often quoted for high dry coupling efficiency.…”
Section: Contributionsmentioning
confidence: 99%
“…The temperature in the near-space can be very low from −50 • C to −70 • C, and it is important to measure the environment temperature around the payloads and other equipment [17]. The temperature sensor system designed in this paper adopts PT100 as a temperature sensor whose resistance changed with temperature.…”
Section: Temperature Sensor Designmentioning
confidence: 99%