Dry Transient Electronic Systems by Use of Materials that Sublime

Kim, Bong Hoon; Kim, Jaehwan; Persano, Luana; Hwang, Suk Won; Lee, Seungmin; Lee, Jungyup; Yu, Yongjoon; Kang, Yongseon; Koo, Jahyun; Cho, Youn Kyoung; Hur, Gyum; Banks, Anthony; Jun, Sangook; Won, Phillip; Song, Young Min; Jang, Kyung In; Kang, Daeshik; Lee, Chi Hwan; Pisignano, Dario; Li, Jinghua

doi:10.1002/adfm.201606008

Cited by 37 publications

(41 citation statements)

References 30 publications

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“…Such technology is also of interest for other, unique classes of applications, ranging from biodegradable, temporary electronic implants to hardware secure data systems and unrecoverable, field-deployed devices (9)(10)(11)(12). Sometimes referred to collectively as transient electronics, these types of devices can be constructed by using designer materials, such as specially formulated polymers or natural products (13)(14)(15)(16), or clever combinations of established materials, well-aligned to existing infrastructure (e.g., device designs, circuit topologies, manufacturing capabilities) in conventional, nontransient electronics (17)(18)(19). The latter approach is particularly attractive due to recent research findings that establish many options in high-quality electronic materials for this purpose, ranging from semiconductor-grade monocrystalline silicon (hydrolysis to hydrogen gas and silicic acid) to dissolvable metals (e.g., Mg, W, Mo) and water-soluble dielectrics (e.g., MgO, SiO 2 , Si 3 N 4 ) (19)(20)(21)(22)(23).…”

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confidence: 99%

Materials and processing approaches for foundry-compatible transient electronics

Chang

Fang

Bower³

et al. 2017

Proc. Natl. Acad. Sci. U.S.A.

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Foundry-based routes to transient silicon electronic devices have the potential to serve as the manufacturing basis for "green" electronic devices, biodegradable implants, hardware secure data storage systems, and unrecoverable remote devices. This article introduces materials and processing approaches that enable state-of-theart silicon complementary metal-oxide-semiconductor (CMOS) foundries to be leveraged for high-performance, water-soluble forms of electronics. The key elements are (i) collections of biodegradable electronic materials (e.g., silicon, tungsten, silicon nitride, silicon dioxide) and device architectures that are compatible with manufacturing procedures currently used in the integrated circuit industry, (ii) release schemes and transfer printing methods for integration of multiple ultrathin components formed in this way onto biodegradable polymer substrates, and (iii) planarization and metallization techniques to yield interconnected and fully functional systems. Various CMOS devices and circuit elements created in this fashion and detailed measurements of their electrical characteristics highlight the capabilities. Accelerated dissolution studies in aqueous environments reveal the chemical kinetics associated with the underlying transient behaviors. The results demonstrate the technical feasibility for using foundry-based routes to sophisticated forms of transient electronic devices, with functional capabilities and cost structures that could support diverse applications in the biomedical, military, industrial, and consumer industries.soft electronics | biodegradable electronics | transfer printing | undercut etching | hydrolysis S emiconductor technology is increasingly essential to nearly all aspects of modern society, with projections of market sizes that will exceed $7 trillion in 2017, equivalent to 10% of the world's gross domestic product (1-4). The rapid and accelerating pace of innovation in this area leads to increases in the frequency with which consumers upgrade their devices, thereby contributing to the production of >50 million tons of electronic waste (e-waste) each year (5, 6). Furthermore, the anticipated emergence of electronics for internet-of-things applications, along with the continued proliferation of radio frequency (RF) identification tags and other high-volume electronic goods, create daunting challenges with the management of this e-waste (7, 8). These considerations motivate research into forms of electronics that can degrade naturally into the environment to harmless end products. Such technology is also of interest for other, unique classes of applications, ranging from biodegradable, temporary electronic implants to hardware secure data systems and unrecoverable, field-deployed devices (9-12). Sometimes referred to collectively as transient electronics, these types of devices can be constructed by using designer materials, such as specially formulated polymers or natural products (13-16), or clever combinations of established materials, well-aligned to existing ...

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confidence: 99%

Materials and processing approaches for foundry-compatible transient electronics

Chang

Fang

Bower³

et al. 2017

Proc. Natl. Acad. Sci. U.S.A.

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“…Bioresorbable components and biodegradable electronics would greatly benefit one from each other findings, both pursuing the same goal of developing high‐quality devices that operate for a prescribed time and then vanish under well‐defined conditions. In both cases, mechanisms for triggering and tuning the dissolution of these devices by using different physico‐chemical conditions, such as, acidic or basic solutions, light exposure, and low or high temperatures, are envisaged to provide a more accurate on‐demand control over dissolution.…”

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confidence: 99%

Bioresorbable Materials on the Rise: From Electronic Components and Physical Sensors to In Vivo Monitoring Systems

2020

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Over the last decade, scientists have dreamed about the development of a bioresorbable technology that exploits a new class of electrical, optical, and sensing components able to operate in physiological conditions for a prescribed time and then disappear, being made of materials that fully dissolve in vivo with biologically benign byproducts upon external stimulation. The final goal is to engineer these components into transient implantable systems that directly interact with organs, tissues, and biofluids in real‐time, retrieve clinical parameters, and provide therapeutic actions tailored to the disease and patient clinical evolution, and then biodegrade without the need for device‐retrieving surgery that may cause tissue lesion or infection. Here, the major results achieved in bioresorbable technology are critically reviewed, with a bottom‐up approach that starts from a rational analysis of dissolution chemistry and kinetics, and biocompatibility of bioresorbable materials, then moves to in vivo performance and stability of electrical and optical bioresorbable components, and eventually focuses on the integration of such components into bioresorbable systems for clinically relevant applications. Finally, the technology readiness levels (TRLs) achieved for the different bioresorbable devices and systems are assessed, hence the open challenges are analyzed and future directions for advancing the technology are envisaged.

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silicon wafer, electronic skin, which is usually fabricated with mechanically compliant materials (low modulus, stretchable, and flexible) overcomes the fundamental mismatch between rigid devices and soft biological tissues. [15][16][17][18] It is obvious that the complicated, expensive fabrication methods, and limited stretchability of inorganic electronic materials restrict their widespread application. Nonstretchable inorganic electronic materials, such as gold, copper, and silver, change the geometric structure to fit the stretched substrates.

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Semi‐Liquid‐Metal‐(Ni‐EGaIn)‐Based Ultraconformable Electronic Tattoo

Guo

Sun

Yao

et al. 2019

Adv Materials Technologies

136

129

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silicon wafer, electronic skin, which is usually fabricated with mechanically compliant materials (low modulus, stretchable, and flexible) overcomes the fundamental mismatch between rigid devices and soft biological tissues. [13,14] At present, inorganic and organic electronic materials integrated with elastomeric substrates are the two popular approaches to fabricate electronic skin. Nonstretchable inorganic electronic materials, such as gold, copper, and silver, change the geometric structure to fit the stretched substrates. [15][16][17][18] It is obvious that the complicated, expensive fabrication methods, and limited stretchability of inorganic electronic materials restrict their widespread application. Alternatively, other inorganic electronic materials, such as nanoparticles [19][20][21] and carbon nanotubes, [22][23][24] are deposited on elastomer substrates to form a thin nanopath that can be extended when the substrates are stretched. With low-cost fabrication methods, such as direct printing [20,25] and transfer printing, [21] these materials have been highly successfully used to fabricate stretchable circuits, [26] sensing arrays, [27] and near field communication antennae. [21] Meanwhile, organic electronic materials, such as conductive small molecules and polymers and carbon-based conductive materials, [28] have good stretchability and their special chemical groups provide good conductivity. [29][30][31] However, the conductivities of nanoparticle layers and organic electronic materials are far lower than those of metal conductors. Thus, it is of great importance to develop new materials with both excellent conductivity and stretchability. Most electronic skin is fabricated on a flat device and subsequently transferred to skin. We suggest that the new conductive materials be directly printed onto the skin using a low-cost preparation method and be super-compliant and customizable.Liquid metal (eutectic gallium-indium, EGaIn) is an attractive conductive material that has shown significant promise for broad applications in flexible electronics. With its high electrical conductivity (EGaIn: 3.4 × 10 6 S m −1 ) [32] and excellent fluidity, [33] liquid metal has attracted great interest in many applications, such as stretchable antennae, [34,35] bioelectrodes, [36] strain sensors, [37] pressure sensors, [38] loudspeakers, [39] and soft robots. [40] Additionally, gallium is nontoxic with low vapor pressure, [41] which can be useful in an ambient environment. [42] Meanwhile, various patterning techniques of liquid metal have also been developed, such as microchannel injection, [43] atomized Because of its seamless skin interface, electronic skin has attracted increasing attention in the field of biomedical sensors and medical devices. Most electronic skins are based on organic or inorganic electronic materials. However, the low flexibility of inorganic materials and the limited conductivity of organic materials restricts their widespread use. A new approach is reported to fabricate electronic tattoos from N...

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Dry Transient Electronic Systems by Use of Materials that Sublime

Cited by 37 publications

References 30 publications

Materials and processing approaches for foundry-compatible transient electronics

Materials and processing approaches for foundry-compatible transient electronics

Bioresorbable Materials on the Rise: From Electronic Components and Physical Sensors to In Vivo Monitoring Systems

Semi‐Liquid‐Metal‐(Ni‐EGaIn)‐Based Ultraconformable Electronic Tattoo

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