2011
DOI: 10.1016/j.tsf.2011.04.069
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Durability study on sputtered indium tin oxide thin film on Poly Ethylene Terephthalate substrate

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Cited by 34 publications
(13 citation statements)
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“…ITO thin layer is subjected to compressive stress when it is placed at the bottom of the sample. Five radii of curvature (5,10,20,30, and 40 mm) are applied for static bending tests, and the specimens are continuously bent until 1000 h. During the bending test, all the specimens are placed in a closed box at room temperature to avoid dust accumulating on the specimens. During the static bending test, the electrical resistance of ITO film is monitored using a source measurement unit (SMU-Keithley 2400, Keithley Instruments, Inc., Cleveland, OH, USA).…”
Section: Static Bending Testmentioning
confidence: 99%
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“…ITO thin layer is subjected to compressive stress when it is placed at the bottom of the sample. Five radii of curvature (5,10,20,30, and 40 mm) are applied for static bending tests, and the specimens are continuously bent until 1000 h. During the bending test, all the specimens are placed in a closed box at room temperature to avoid dust accumulating on the specimens. During the static bending test, the electrical resistance of ITO film is monitored using a source measurement unit (SMU-Keithley 2400, Keithley Instruments, Inc., Cleveland, OH, USA).…”
Section: Static Bending Testmentioning
confidence: 99%
“…Their results show that Young's modulus of the substrate significantly affects the conductive stability of ITO electrode and mechanical properties of ITO/substrate film [12]. A cyclic bending test was also conducted to investigate the electrical conductivity of ITO thin film under various conditions of temperature and humidity [20,42]. Their results show that cyclic bending deformation is the dominant factor for the electrical resistance increase in those ITO films.…”
Section: Introductionmentioning
confidence: 99%
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“…Although many flexible devices have been developed, and although their flexibility has been investigated through cyclic bending tests [32][33][34][35][36][37][38][39][40][41], little attention has been paid to suitable packaging technologies for these devices. Packaging has stagnated due to the reuse of existing technologies, such as connectors and ACFs; however, there is a question about whether these existing technologies are sufficient.…”
Section: Introductionmentioning
confidence: 99%
“…studied bending fatigue of ITO‐coated PET substrate; the effect of bending diameter and number of bending cycles was investigated. In another study by Hamasha et al ., the effects of environmental factors, such as humidity and temperature, were studied in the bending of ITO‐coated PET films. Aluminum‐doped zinc oxide, as a low‐cost alternative of ITO, on flexible substrates, such as willow glass and polyimide films, were also studied in cyclic bending.…”
Section: Introductionmentioning
confidence: 99%