Dynamic Anti-Plane Characteristic of Two Dissimilar Piezoelectric Media with an Interfacial Crack

Abstract

Dynamic anti-plane characteristic is investigated theoretically on two dissimilar piezoelectric media with an interfacial crack subjected to time-harmonic incident anti-plane shearing in this paper. The formulations are based on the method of complex variable and Green’s function. Dynamic stress intensity factors at the crack’s tip are obtained by solving boundary value problems with the methods of conjunction and crack-division technique. The calculating results are plotted to show how the frequencies of incident wave, all kinds physical parameters of two dissimilar piezoelectric materials, applied electric loads and the dimension of the interfacial crack influence upon the dynamic stress intensity factor (DSIF). And some of the calculating results are compared with other published documents.

Dynamic fracture behavior for hole-initiated cracks in functionally graded magneto-electro-elastic bi-materials

“…Therefore, this paper attempts to construct effectively analytical methods to address such problems. Some methods such as Green's function method, interface-conjunction, and crackdeviation techniques are introduced into the present analysis [26][27][28]. Significantly, the governing equations and wave field expressions in this paper are much more complicated than those in Zhong and Li's [29] studies because of particular the effects for material gradient and the scattering caused by hole, furthermore, compared with the conventional dual integral equations methods [29][30][31][32], the methods in this paper are more suitable for multi-defect problems in engineering.…”