2019
DOI: 10.1016/b978-0-08-102572-7.00006-4
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Dynamic effects in siloxane PECVD coatings

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Cited by 2 publications
(2 citation statements)
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“…Thermally activated chemical vapor deposition processes cannot be used for PC treatment because of deposition temperature limitations, so only plasma‐enhanced chemical vapor deposition (PECVD) processes are applicable to form hard inorganic coatings on PC, and they have been successfully used for the formation of abrasion and scratch‐resistant coatings. [ 6,8,9 ]…”
Section: Introductionmentioning
confidence: 99%
See 1 more Smart Citation
“…Thermally activated chemical vapor deposition processes cannot be used for PC treatment because of deposition temperature limitations, so only plasma‐enhanced chemical vapor deposition (PECVD) processes are applicable to form hard inorganic coatings on PC, and they have been successfully used for the formation of abrasion and scratch‐resistant coatings. [ 6,8,9 ]…”
Section: Introductionmentioning
confidence: 99%
“…Thermally activated chemical vapor deposition processes cannot be used for PC treatment because of deposition temperature limitations, so only plasmaenhanced chemical vapor deposition (PECVD) processes are applicable to form hard inorganic coatings on PC, and they have been successfully used for the formation of abrasion and scratch-resistant coatings. [6,8,9] Low-temperature plasma-enhanced CVD processes are of particular interest because they allow the formation of organic-inorganic coatings due to their essence. For example, silicon dioxide films deposited by PECVD always contain fragments of incompletely reacted precursor playing the role of an organic component.…”
Section: Introductionmentioning
confidence: 99%