Dynamic Electrothermal Macromodeling: an Application to Signal Integrity Analysis in Highly Integrated Electronic Systems

d’Alessandro, V.; Magistris, M. de; Magnani, Alessandro; Rinaldi, N.; Russo, Salvatore

doi:10.1109/tcpmt.2013.2253609

Cited by 15 publications

(21 citation statements)

References 32 publications

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“…The control algorithm is designed so as to provide a 50 Hz pure sine current computed by extracting a DCTM, which is then simulated [21], or with standard transient FEM simulations by activating one HS at a time, e.g., [32][33][34]. Figure 3 on a desktop PC equipped with an octa-core Intel i7-5960X and 64 GB RAM, leading to a total of 5 × 8 = 40 h for computing the whole ZTH(t) as required by fitting-based DCTMs, e.g., [18,20].…”

Section: Experimental Results: Power Model Equipped With a Poorly Permentioning

confidence: 99%

“…The thermal resistance R TH represents the steady state value of the thermal impedance. Z TH can be computed by extracting a DCTM, which is then simulated [21], or with standard transient FEM simulations by activating one HS at a time, e.g., [32][33][34]. In this work, two validations of the model and its IIR implementation have been proposed; (a) standard FEM simulations are compared to the ones performed with the IIR filter; and (b) an experimental setup was built to compare the baseplate temperature estimation with the measurement of a thermocouple (Fluke 179) mounted on its surface.…”

Section: Experimental Results: Power Model Equipped With a Poorly Permentioning

confidence: 99%

“…• From simulated or measured thermal impedance data with semi-automatic fitting [29] or with standard macromodeling procedures in either time [30][31][32][33] or frequency domain [34].…”

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confidence: 99%

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On-Line Junction Temperature Monitoring of Switching Devices with Dynamic Compact Thermal Models Extracted with Model Order Reduction

et al. 2017

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Abstract:Residual lifetime estimation has gained a key point among the techniques that improve the reliability and the efficiency of power converters. The main cause of failures are the junction temperature cycles exhibited by switching devices during their normal operation; therefore, reliable power converter lifetime estimation requires the knowledge of the junction temperature time profile. Since on-line dynamic temperature measurements are extremely difficult, in this work an innovative real-time monitoring strategy is proposed, which is capable of estimating the junction temperature profile from the measurement of the dissipated powers through an accurate and compact thermal model of the whole power module. The equations of this model can be easily implemented inside a FPGA, exploiting the control architecture already present in modern power converters. Experimental results on an IGBT power module demonstrate the reliability of the proposed method.

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Section: Experimental Results: Power Model Equipped With a Poorly Permentioning

confidence: 99%

Section: Experimental Results: Power Model Equipped With a Poorly Permentioning

confidence: 99%

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On-Line Junction Temperature Monitoring of Switching Devices with Dynamic Compact Thermal Models Extracted with Model Order Reduction

et al. 2017

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“…An interesting approach is based on the identification of compact thermal models, i.e., models describing the heat propagation through the component/system at defined regions of interest by resorting to the thermal impedance matrix [6], [7]. Following this approach, the thermal problem is first analyzed with standard 3-D numerical tools, by which data samples of the thermal step response at prescribed input/output ports of the system are computed; then, from such data, a TF network is identified and subsequently used in ET simulations, with great advantage in terms of affordability.…”

mentioning

confidence: 99%

“…Following this approach, the thermal problem is first analyzed with standard 3-D numerical tools, by which data samples of the thermal step response at prescribed input/output ports of the system are computed; then, from such data, a TF network is identified and subsequently used in ET simulations, with great advantage in terms of affordability. However, a number of preliminary CPU/memory demanding 3-D thermal simulations is required (in principle one for each heat source) exploting numerical solvers based, for example, on the finite element method (FEM) [6], [7]. Considering that a typical design process includes activities such as parameters space exploration and variability analysis, both the mesh generation and the whole set of simulations must be repeated for several values of the design parameters (e.g., layout features), which leads to a very significant computational cost.…”

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confidence: 99%

Effective Electrothermal Analysis of Electronic Devices and Systems with Parameterized Macromodeling

Ferranti

Magnani

d’Alessandro

et al. 2015

IEEE Trans. Compon., Packag. Manufact. Technol.

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Abstract-We propose a parameterized macromodeling methodology to effectively and accurately carry out dynamic electrothermal simulations of electronic components and systems, while taking into account the influence of key design parameters on the system behavior. In order to improve the accuracy and to reduce the number of the computationally expensive thermal simulations needed for the macromodel generation, a decomposition of the frequency-domain data samples of the thermal impedance matrix is proposed. The approach is applied to study the impact of layout variations on the dynamic electrothermal behavior of a state-of-the-art 8-finger AlGaN/GaN HEMT grown on a SiC substrate. Simulation results confirm the high accuracy and computational gain obtained by using parameterized macromodels instead of a standard method based on iterative complete numerical analysis.

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Advancements in the identification of passive RC networks for compact modeling of thermal effects in electronic devices and systems

Tommasi

Magnani

Magistris

2017

Int J Numerical Modelling

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We deal with the problem of identifying the parameters of an equivalent lumped RC multiport network from time domain tabulated data of a corresponding distributed real eigenvalues problem, as obtained from either measurements or accurate simulation tools. A novel step response matrix identification procedure is proposed, based on the combination of an outer nonlinear least squares iteration for the relocation of time constants, and an inner convex programming cycle for the identification of the corresponding residue matrix terms, able to guarantee a priori the passivity property of the equivalent RC network. The structure of the algorithm and its principal functions connections are shown, and the mathematical features of the proposed formulation of the identification problem are accurately described and commented. Moreover, the possibility of getting direct synthesis of a Foster generalized concretely passive multiport, as a consequence of the optimal identification of a passive real eigenvalues model from data, is discussed. Since the technique is well suited (although not limited) to the reduced analysis of typical electro‐thermal problems, a set of significant case studies in this area is considered. In this way the algorithm present implementation is validated, also comparing it to previous well assessed methods, evidencing its large potential and value.

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Dynamic Electrothermal Macromodeling: an Application to Signal Integrity Analysis in Highly Integrated Electronic Systems

Cited by 15 publications

References 32 publications

On-Line Junction Temperature Monitoring of Switching Devices with Dynamic Compact Thermal Models Extracted with Model Order Reduction

On-Line Junction Temperature Monitoring of Switching Devices with Dynamic Compact Thermal Models Extracted with Model Order Reduction

Effective Electrothermal Analysis of Electronic Devices and Systems with Parameterized Macromodeling

Advancements in the identification of passive RC networks for compact modeling of thermal effects in electronic devices and systems

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