Early analysis of cost/performance trade-offs in MCM systems

Garg, Vivek; Schimmel, D.E.; Stogner, D.; Ulmer, Craig D.; Wills, D.S.; Yalamanchili, S.

doi:10.1109/iciss.1996.552430

Cited by 4 publications

(6 citation statements)

References 16 publications

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“…Research articles that address cost estimation at the early stage of product development using traditional cost estimation and optimization techniques are summarized as follows. Between 1990 and 1998, there was a lot of interest in performing technology trade-off analysis specifically for electronic systems, 6,7 although these works were focused on manufacturing cost for high-volume rather than low-volume products. Other authors such as Bode 1 compared the performance of neural networks against other conventional cost estimation methods at the early stage of product development.…”

Section: Literature Reviewmentioning

confidence: 99%

“…Some typical approaches and techniques used to support cost estimating decision-making during product development are trade-off analyses, parametric, product family, variant, analytical, learning curve, neural network and life cycle costing. 1,6 –15 However, these methods in general would not be applicable for low-volume, high-complexity (LVHC), long-life products, especially for a brand new design of this kind of product where insufficient data could reduce the statistical significance of the estimation accuracy. A typical example is the multi-function display (MFD) unit that is usually mounted on the instrument binnacle of a fighter cockpit.…”

Section: Introductionmentioning

confidence: 99%

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Cost data modelling and searching to support low-volume, high-complexity, long-life defence system development

Cheung

Marsh

Newnes

et al. 2014

Proceedings of the Institution of Mechanical Engineers, Part B:

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This paper presents a data modelling and a semi-automatic data searching method to support cost estimation in the product development process, particularly for low volume, high complexity and long life products typified by defence products and systems. The paper covers a literature review in the area of cost estimation in product development, the data sets needed to perform cost estimation, the method of modelling the data and the techniques of supporting cost data searching. The proposed method will be used to support cost estimation of product development decisions for defence electronic products. To compare with the traditional approach, the method * Corresponding author: Faculty of Engineering and Environment, University of Northumbria, Newcastle Upon Tyne NE1 8ST, UK; wai.m.cheung@northumbria.ac.uk Cost Data Modelling and Searching to Support Low Volume, HighComplexity, Long Life Defence Systems Development has demonstrated that by creating a centralised environment such as the 'databases and using a data-driven' approach. The system is made more efficient by reducing the number of processes in carrying out cost estimation and thus this provides more information to make an informed concept design decision during the product development process based on the system's competence of instant cost estimation feedback.Keywords: Product development; Cost modelling; Low volume products; Data driven cost estimation; Electronic and Mechanical Modular-based Library INTRODUCTIONAccurate and reliable cost estimates require historical data and information to be made available. This is applicable to all types of manufactured products. As pointed out by Bode [1], cost estimation at the early stage of product development has always been difficult due to the availability of limited attribute information. In addition, accurate and reliable cost estimation can only be obtained at a later stage of the development process when more information and data are presented. This is due to the cost models and systems used that require a large amount of detailed data before a cost calculation could be made [2].It is common knowledge that in each phase of the development of a product, a company spends money and also incurs future costs. For example, in drugs development, the process of developing new drugs is lengthy and costly. As such a large percentage of the cost in developing new drugs is in research and development.According to DiMasi [3], to produce an estimate of expected cost for a marketed product, the drug development company must allocate the costs of the unsuccessful projects to those that result in a marketed new product. As such, the estimated average This paper therefore proposes a new approach of performing cost data modelling coupled with a semi-automatic searching mechanism to address cost estimation at the product development stage for LVHC long life products. The modelling method is unique due to dedicated modules that are used to capture relevant data to support the initial product configuration process to gen...

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Section: Literature Reviewmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Cost data modelling and searching to support low-volume, high-complexity, long-life defence system development

Cheung

Marsh

Newnes

et al. 2014

Proceedings of the Institution of Mechanical Engineers, Part B:

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“…This model was further validated and used in [24], and also used in [25]. However, in modern technologies, the number of available wiring levels is much higher, and the variation in wire pitch between the lowest and highest levels is significant; for example, the pitch of a global wire is typically several times that of local wires.…”

Section: A Chip/module Area Modelsmentioning

confidence: 99%

Two-Dimensional and Three-Dimensional Integration of Heterogeneous Electronic Systems Under Cost, Performance, and Technological Constraints

Weerasekera

Pamunuwa

Zheng

et al. 2009

IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst.

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Abstract-Present day market demand for high-performance high-density portable hand-held applications has shifted the focus from 2-D planar system-on-a-chip-type single-chip solutions to alternatives such as tiled silicon and single-level embedded modules as well as 3-D die stacks. Among the various choices, finding an optimal solution for system implementation deals usually with cost, performance, power, thermal, and technological tradeoff analyses at the system conceptual level. It has been estimated that decisions made in the first 20% of the design cycle influence up to 80% of the final product cost. In this paper, we discuss realistic metrics appropriate for performance and cost tradeoff analyses both at the system conceptual level in the early stages of the design cycle and in the implementation phase, for verification. In order to validate the proposed metrics and methodology, two ubiquitous electronic systems are analyzed under various implementation schemes and the performance tradeoffs discussed. This case study is used to highlight the importance of a cost and performance tradeoff analysis early in the design flow.Index Terms-Die stacking, performance and cost tradeoffs, power consumption, system-in-package (SiP), system-on-chip (SoC), system-on-package (SoP), thermal analysis, wafer-level integration (WLI), 3-D integration.

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“…highdensity substrats with lines pitches less than 30µm, integrated de-coupling capacitors, high-density interconnect with about 4000 interconnects/cm 2 [6], threedimensional packaging technologies to shorten the signal lines and for high-speed communication also integrated optical interconnects. Co-design oriented CAD tools have to support the distributed functionality on the signal and clock level, in system partitioning [7], in thermics, and finally in the exploration of test, yield and costs [8].…”

Section: Barriers and Enabling Technologiesmentioning

confidence: 99%

Potentials of chip-package co-design for high-speed digital applications

Tröster

1999

Proceedings of the Conference on Design, Automation and Test in Europe

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The inherent potentials of the Si technology are limited by the low interaction with packaging. Co-design as the symbiosis between the ICs and appropriate high-density packaging offers lower RC line delay, improved SSN and lower costs compared to single-chip approaches. The distribution of the system functionality between IC and the packaging level opens up new vistas in future electronic design and system architecture. Roadmaps and co-design approachThe SIA roadmap for semiconductors [1] shows an undiminished performance increase of the inherent Si device technology over the next decade. But the overall system performance depends also on the packaging as the interconnect to the system environment. A low interaction between IC and packaging design will more and more limit the system potentials. The novel chip-package co-design approach with the objective of exploiting the synergism of ICs and packaging through their concurrent and matched design is clearly focused on system-level. For the challanges in high-speed digital design, clock delay, memory bandwidth, signal switching noise and cost/performance the co-design approach offers attractive solutions.

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Early analysis of cost/performance trade-offs in MCM systems

Cited by 4 publications

References 16 publications

Cost data modelling and searching to support low-volume, high-complexity, long-life defence system development

Cost data modelling and searching to support low-volume, high-complexity, long-life defence system development

Two-Dimensional and Three-Dimensional Integration of Heterogeneous Electronic Systems Under Cost, Performance, and Technological Constraints

Potentials of chip-package co-design for high-speed digital applications

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