Ecofriendly ethanol-developable processes for electron beam lithography using positive-tone dextrin resist material

Takei, Satoshi; Sugino, Naoto; Hanabata, Makoto; Oshima, Akira; Kashiwakura, Miki; Kozawa, Takahiro; Tagawa, Seiichi

doi:10.7567/apex.10.076502

Cited by 13 publications

(11 citation statements)

References 30 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…13 Close attention has also been paid to polysaccharides that could be good candidates for commercial photoresist replacement. It was shown that cellulose 4,8 alginate, 14 dextrin, 6 and pullulan 15 can be used as photolithography resists. Nevertheless, the abovementioned polysaccharides need to be chemically modified to acquire electro-or photosensitivity.…”

Section: Introductionmentioning

confidence: 99%

Chitosan as a Water-Developable 193 nm Photoresist for Green Photolithography

Sysova

Durin

Gablin

et al. 2022

ACS Appl. Polym. Mater.

View full text Add to dashboard Cite

The development of environmentally friendly materials and processes is a major issue that concerns all industrial sectors, including microelectronics. The aim of this study is to demonstrate the possibility of using chitosan-based photoresists for microelectronic applications on silicon by 193 nm photolithography. The photopatterning of chitosan films is demonstrated and analyzed by different spectroscopy and microscopy techniques. In particular, it is shown that 193 nm irradiation allows one to induce chain breaks that modify the solubility of chitosan in an aqueous developing solution, without denaturing the chitosan macromolecule chains. This mechanism allows one to obtain patterns, and it is shown that these patterns can be transferred by physical etching into silica. It is also demonstrated that the formulated resins are compatible with industrial spin-coating and exposure tools, which opens very interesting perspectives for these chitosan-based positive resins in a microelectronic context.

show abstract

Section: Introductionmentioning

confidence: 99%

Chitosan as a Water-Developable 193 nm Photoresist for Green Photolithography

Sysova

Durin

Gablin

et al. 2022

ACS Appl. Polym. Mater.

View full text Add to dashboard Cite

show abstract

“…The reported water-developable biomass resist material was used in an electron beam nanolithography tool (CABL-8000TPU, Crestec), and a reactive ion etcher RIE-10NR (Samco) was utilized for creating the quartz mold to draw 900-nm lines. [32,33] The patterning of the non-solvent-permeable quartz mold was performed for 10 min using tridecafluro-1,1,2,2-tetrahydrooctyld imethylchlorosilane after the surface was exposed to electron beam (EB) irradiation with energy of 90 kV. Compact electron beam system (EC90/10/50LS-T, Iwasaki Electric) was used to obtain anti-adhesion between the quartz mold and the patterning materials.…”

Section: Methodsmentioning

confidence: 99%

Direct Nanoimprint Lithography of Polyethersulfone Using Cellulose‐Based Mold

Takei

2020

Macro Materials & Eng

Self Cite

View full text Add to dashboard Cite

and resist materials were investigated for the expanded nanoimprint lithography and application of biomass resources. [21][22][23][24][25] Herein, high-accuracy nanopatterning of PES using dimethylformamide as a dilution solvent was obtained by direct thermal nano imprint lithography using the newly modified solvent-permeable cellulosebased mold.In summary, the 900-nm line pattern failure of PES containing dimethylformamide as a dilution solvent was solved using the solvent-permeable cellulosebased mold. The direct nanoimprint lithography using the new solvent-permeable mold and solvent-mixed super-engineering plastics has realized the surface nanostructures of PES. Experimental SectionThe structures of a) hydroxypropyl cellulose with thermally cross-linked acryloyloxyalkyl groups in the solvent-permeable cellulose-based mold, b) 2-hydroxy-2-methylpropiophenone as an ultraviolet(UV) initiator, c) azobisisobutyronitrile as a thermal initiator, d) polyethersulfone, e) dimethylformamide as a dilution solvent with high solubility for increasing the fluidity of PES, f) novolac derivatives with hydroxyl groups to react with the cross-linker to improve adhesion to polyethersulfone during the imprinting process, g) 1,3,4,6-tetrakis(methoxymethyl) glycoluril as a cross-linker, and h) pyridinium p-toluenesulfonate as an initiator are shown in Figure 1.2-Methacryloyloxyalkyl isocyanate was reacted with hydroxypropyl cellulose to add thermally cross-linked acryloyloxyalkyl groups into the hydroxypropyl cellulose to prepare the solvent-permeable cellulose-based mold. The resulting chemical reaction between 2-methacryloyloxyalkyl isocyanates and hydroxypropyl cellulose was evaluated using attenuated total reflectance Fourier transform infrared spectroscopy. [26][27][28] Methyl ethyl ketone was blended with 2-methacryloyloxyalkyl isocyanates and hydroxypropyl cellulose. The content of 2-methacryloyloxyalkyl isocyanate and hydroxypropyl cellulose in the solution was 26 wt%. The solution was stirred under a nitrogen atmosphere at 63 °C for 2.5 h, after adding triethylamine with a concentration of 7.9 wt% to the solution. Gel-permeation chromatography (HLC-8320GPC, Tosoh) was used to obtain the molecular weight of solvent-permeable cellulosebased mold. The solvent-permeable cellulose-based mold with an average molecular weight of 53 000 relative to a polystyrene standard was developed. The solvent-permeable cellulose-based mold with thermally cross-linked acryloyloxyalkyl groups was formulated with the following concentrations: 95 wt% of cellulose derivative, 2.5 wt% of 2-hydroxy-2-methylpropiophenone, and 2.5 wt% of azobisisobutyronitrile as a thermal initiator.The adhesion underlayer material on substrates, such as stainless mesh plate and silicon wafer was prepared to provide an adhesion between the substrates and patterning materials, such as PES and solvent-permeable cellulose-based mold, thereby reducing the pattern Polyethersulfone (PES) with a glass transition temperature of 224 °C is a class of high-performance super engi...

show abstract

“…The first particular solution to mention is a sugar‐based negative tone resist [ 146 ] that facilitated water‐based development of the resist film with a 100 nm resolution at 18 µC cm −2 (30 kV). Another example, natural linear polysaccharide pullulan, [ 151 ] demonstrated a resolution of 100 nm at a sensitivity of 10 µC cm −2 . This negative tone resist is compatible with both EUV and e‐beam exposure.…”

Section: Patterning Approachesmentioning

confidence: 99%

“…Another example of polysaccharides, dextrin derivatives, [ 151 ] demonstrated a high resolution (20 nm) positive tone ethanol‐developable resist behavior with the sensitivity of roughly 1800 µC cm −2 (125 kV). However, the obtained derivative was not water‐soluble, which limited application toward bio‐organic materials.…”

Section: Patterning Approachesmentioning

confidence: 99%

Gentle Patterning Approaches toward Compatibility with Bio‐Organic Materials and Their Environmental Aspects

Grebenko

Motovilov

Bubis

et al. 2022

Small

View full text Add to dashboard Cite

Advances in material science, bio-electronic, and implantable medicine combined with recent requests for eco-friendly materials and technologies inevitably formulate new challenges for nano-and micro-patterning techniques. Overall, the importance of creating micro and nanostructures is motivated by a large manifold of fundamental and applied properties accessible only at the nanoscale. Lithography is a crucial family of fabrication methods to create prototypes and produce devices on an industrial scale. The pure trend in the miniaturization of critical electronic semiconducting components is recently enhanced by implementing bio-organic systems in electronics. So far, significant efforts have been made to find novel lithographic approaches and develop old ones to reach compatibility with delicate bio-organic systems and minimize the impact on the environment. Herein, we briefly review such delicate materials and sophisticated patterning techniques.

show abstract

Ecofriendly ethanol-developable processes for electron beam lithography using positive-tone dextrin resist material

Cited by 13 publications

References 30 publications

Chitosan as a Water-Developable 193 nm Photoresist for Green Photolithography

Chitosan as a Water-Developable 193 nm Photoresist for Green Photolithography

Direct Nanoimprint Lithography of Polyethersulfone Using Cellulose‐Based Mold

Gentle Patterning Approaches toward Compatibility with Bio‐Organic Materials and Their Environmental Aspects

Contact Info

Product

Resources

About