Effect of Ag solutes on the solid-state Cu dissolution in the Sn3.5Ag

Wang, Jyun Yang; Lin, Yuxiao; Yeh, C. Y.; Chiu, Chung Yu; Lin, E. J.; Wu, Chi-Wei; Lee, Chia Hung; Chang, Pai Jung; Liu, Cheng Yi

doi:10.1007/s10854-020-04839-w

Cited by 3 publications

(1 citation statement)

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“…They conducted electromigration tests on Sn-based solder on a Cu substrate and found that, under the electromigration conditions, the activation energy for Cu dissolution into Sn-based solder is lower than that into Sn3.5Ag solder (1.48 eV). This is because, within a lower temperature range, the presence of Ag solute, which forms the Ag 3 Sn phase, adheres to the interface Cu-Sn compound layer and inhibits the dissolution of Cu 6 Sn 5 , thereby impeding the dissolution of the interface Cu 6 Sn 5 compound layer [ 90 ].…”

Section: Methods and Measures Of Electromigration Mitigation For Snbi...mentioning

confidence: 99%

Research Overview on the Electromigration Reliability of SnBi Solder Alloy

Li,

Guo,

et al. 2024

Materials

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Due to the continuous miniaturization and high current-carrying demands in the field of integrated circuits, as well as the desire to save space and improve computational capabilities, there is a constant drive to reduce the size of integrated circuits. However, highly integrated circuits also bring about challenges such as high current density and excessive Joule heating, leading to a series of reliability issues caused by electromigration. Therefore, the service reliability of integrated circuits has always been a concern. Sn-based solders are widely recognized in the industry due to their availability, minimal technical issues during operation, and good compatibility with traditional solders. However, solders that are mostly Sn-based, such as SAC305 and SnZn, have a high melting point for sophisticated electronic circuits. When Bi is added, the melting point of the solder decreases but may also lead to problems related to electromigration reliability. This article reviews the general principles of electromigration in SnBi solder joints on Cu substrates with current flow, as well as the phenomena of whisker formation, voids/cracks, phase separation, and resistance increase caused by atomic migration due to electromigration. Furthermore, it explores methods to enhance the reliability of solder joint by additives including Fe, Ni, Ag, Zn, Co, RA (rare earth element), GNSs (graphene nanosheets), FNS (Fullerene) and Al2O3. Additionally, modifying the crystal orientation within the solder joint or introducing stress to the joint can also improve its reliability to some extent without changing the composition conditions. The corresponding mechanisms of reliability enhancement are also compared and discussed among the literature.

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Section: Methods and Measures Of Electromigration Mitigation For Snbi...mentioning

confidence: 99%