Effect of aging on mechanical properties of high temperature Pb-rich solder joints

Khatibi, Golta; Kotas, A. Betzwar; Lederer, M.

doi:10.1016/j.microrel.2018.03.009

Cited by 25 publications

(9 citation statements)

References 25 publications

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“…At present, the high-temperature solder alloys used for third-generation semiconductors are still primarily high-lead alloys (Khatibi et al, 2018;Meng et al, 2017). Due to the toxicity of lead, many countries have limited the usage of conventional lead-based solder and instead have promoted the development of alternative lead-free alloys, via legislation such as the Restriction of Hazardous Substances (RoHS) directive of the European Union (Mcluskey et al, 2006;Kisiel, 2002).…”

Section: Introductionmentioning

confidence: 99%

Wetting characteristics of Sn-5Sb-CuNiAg lead-free solders on the copper substrate

Wang

Sun

Han

et al. 2021

SSMT

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Purpose The purpose of this paper is to investigate the wetting behaviors of Sn-5Sb-CuNiAg solders on copper substrates in different soldering processes and the effects of alloying elements on the wettability. Design/methodology/approach Sn-5Sb-CuNiAg solder balls (750 µm in diameter) were spread and wetted on 40 × 40 × 1 mm copper plates, in different fluxes, soldering temperatures and time. The contact angles were obtained by a home-made measuring instrument. The samples were polished and deep etched before analyzed by scanning electron microscopy. Energy dispersive X-ray spectroscopy was used to identify the composition of the joints. Findings The effects of different soldering processes and alloying elements on the wetting behaviors of Sn-5Sb-CuNiAg solders on copper substrates were calculated and expounded. The rosin-based flux could effectively remove oxidation layers and improve the wettability of Sn-5Sb-CuNiAg solders. Then with the increase of soldering temperature and time, the contact angles decreased gradually. The soldering processes suited for Sn-5Sb-CuNiAg solders were RMA218, 280°C and 30 s. Considered the effects of alloying elements, the wettability of Sn-5Sb-0.5Cu-0.1Ni-0.5Ag was relatively favorable on copper substrates. Besides, Ni could accumulate at the solder/Cu interface and form a jagged (Cu,Ni)6Sn5 IMC. Originality/value This work was carried out with our handmade experiment equipment and the production of the quinary lead-free solder alloy used in wetting tests belongs to us. The investigated Sn-5Sb-CuNiAg alloys exhibited higher melting point and preferable wettability, that was one of the candidates for high-temperature lead-free solders to replace high-Pb solders, and applied extremely to high temperature and frequency working environments of the third-generation semiconductors components, with a greater potential research and development value.

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Section: Introductionmentioning

confidence: 99%

Wetting characteristics of Sn-5Sb-CuNiAg lead-free solders on the copper substrate

Wang

Sun

Han

et al. 2021

SSMT

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“…The plastic behavior of the copper leads and baseplate can also be added to the model, but this is left out due not being a failure-prone part of the component. The parameters used in the plastic models can be found in [29][30][31][32][33]. In order to more realistically model the strain rate dependent behavior of the 95Pb-5Sn solder, the ANAND model can also be implemented [34].…”

Section: Fem Mosfet Model Constructionmentioning

confidence: 99%

Thermo-Mechanical Stress Comparison of a GaN and SiC MOSFET for Photovoltaic Applications

et al. 2020

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Integrating photovoltaic applications within urban environments creates the need for more compact and efficient power electronics that can guarantee long lifetimes. The upcoming wide-bandgap semiconductor devices show great promise in providing the first two properties, but their packaging requires further testing in order to optimize their reliability. This paper demonstrates one iteration of the design for reliability methodology used in order to compare the generated thermo-mechanical stress in the die attach and the bond wires of a GaN and SiC MOSFET. An electro-thermal model of a photovoltaic string inverter is used in order to translate a cloudy and a clear one-hour mission profile from Arizona into a junction losses profile. Subsequently, the finite element method models of both devices are constructed through reverse engineering in order to analyze the plastic energy. The results show that the plastic energy in the die attach caused by a cloudy mission-profile is much higher than that caused by a clear mission-profile. The GaN MOSFET, in spite of its reduced losses, endures around 5 times more plastic energy dissipation density in its die attach than the SiC MOSFET while the reverse is true for the bond wires. Potential design adaptations for both devices have been suggested to initiate a new iteration in the design for reliability methodology, which will ultimately lead to a more reliable design.

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“…Esfandyari et al [1] developed a simulation model using the finite element method to study the optimization relationship between process parameters, simulated thermal processes, and porosity in solder joints of a reflow oven under pressure. Khatibi et al [2] conducted finite element simulations of PbSnAg solder using a stress rate and pressurerelated material model to analyze its stress and strain states under static and cyclic loading conditions. Li Z.H.…”

Section: Introductionmentioning

confidence: 99%

Optimization Method for Hot Air Reflow Soldering Process Based on Robust Design

Ran,

Chen,

Chen

et al. 2023

Processes

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The process design of hot air reflow soldering is one of the key factors affecting the quality of PCBA (Printed Circuit Board Assembly) component products. In order to improve the product quality during the design process, this paper proposes a robust optimization-based finite element simulation analysis method including significant influencing factor screening, robustness evaluation, robust optimization, and reliability verification for the reflow soldering process. The simulation model of the reflow soldering process temperature field based on experiments is constructed and validated. Sensitivity analysis is used to select important influencing factors, such as the last five set temperature zones (T5 to T9) in the reflow oven and the thermal properties of materials such as PCBs (printed circuit boards), BGAs (ball grid arrays), and solder paste, as well as noise factors like the heating environment during the soldering process. Several surrogate models are used to construct the response surface, and the optimal fitting scheme is selected to effectively avoid poor fitting caused by inappropriate surrogate models. The 6σ robust optimization approach is introduced to evaluate and optimize the robustness of the process design parameter where the heating factor is chosen as the optimization target. The reliability analysis method is employed to validate the product quality. This paper establishes a comprehensive robustness analysis method for hot air reflow soldering, effectively reducing design costs and addressing the lack of robustness analysis in the current hot air reflow soldering process design.

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Effect of aging on mechanical properties of high temperature Pb-rich solder joints

Cited by 25 publications

References 25 publications

Wetting characteristics of Sn-5Sb-CuNiAg lead-free solders on the copper substrate

Wetting characteristics of Sn-5Sb-CuNiAg lead-free solders on the copper substrate

Thermo-Mechanical Stress Comparison of a GaN and SiC MOSFET for Photovoltaic Applications

Optimization Method for Hot Air Reflow Soldering Process Based on Robust Design

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