2007
DOI: 10.1016/j.matchemphys.2007.05.049
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Effect of alloying elements on the isothermal solidification during TLP bonding of SS 410 and SS 321 using a BNi-2 interlayer

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Cited by 46 publications
(16 citation statements)
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“…It has been reported that boron in the filler metal readily diffused into the base metal (Shiue et al, 2002;Arafin et al, 2007) and apparently, if the brazing temperature was low, there would be a certain amount of boron left in the brazing seam, forming the brittle phases at room temperature. The brittle phases formed in the brazing seam at 1050 • C were caused by the following two reasons.…”
Section: Resultsmentioning
confidence: 99%
“…It has been reported that boron in the filler metal readily diffused into the base metal (Shiue et al, 2002;Arafin et al, 2007) and apparently, if the brazing temperature was low, there would be a certain amount of boron left in the brazing seam, forming the brittle phases at room temperature. The brittle phases formed in the brazing seam at 1050 • C were caused by the following two reasons.…”
Section: Resultsmentioning
confidence: 99%
“…The ejection of B into adjacent melt because of low solubility of B in Ni (0.3 at. pct [15,[21][22][23][24][25][26][27] presented in Table IV) and the partition coefficient of B in Ni (~0.008, based on the Ni-B binary phase diagram [22,27] ) shifts the melt composition toward the eutectic composition. The enrichment of B and the formation of Ni 3 B lead to an increase in B concentration in the ASZ.…”
Section: Resultsmentioning
confidence: 99%
“…pct). [15,[21][22][23][24][25][26][27] Thus, at the higher bonding temperature used in the present work, on the one hand, the solubility of the melting point depressant B in the ISZ is decreased (i.e., C aL is decreased), as shown in Figure 18(b), owing to more diffusion of the base alloying elements, particularly Fe, from the substrate into the interlayer. In addition, according to the Ni-B phase diagram, an increase in bonding temperature above the eutectic temperature simultaneously reduces the solubility of B in Ni.…”
Section: B No Bn Precipitates In the Bonding-affected Zonementioning
confidence: 97%
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