“…pct). [15,[21][22][23][24][25][26][27] Thus, at the higher bonding temperature used in the present work, on the one hand, the solubility of the melting point depressant B in the ISZ is decreased (i.e., C aL is decreased), as shown in Figure 18(b), owing to more diffusion of the base alloying elements, particularly Fe, from the substrate into the interlayer. In addition, according to the Ni-B phase diagram, an increase in bonding temperature above the eutectic temperature simultaneously reduces the solubility of B in Ni.…”