2020
DOI: 10.3390/ma13020369
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Effect of Annealing on the Interface and Mechanical Properties of Cu-Al-Cu Laminated Composite Prepared with Cold Rolling

Abstract: Cu-Al-Cu laminated composite was prepared with cold roll bonding process and annealing was carried out to study the phase evolution during the annealing process and its effect on the mechanical properties of the composite. The experimental results showed that after annealing the brittle intermetallics in the interface mainly includes Al4Cu9, AlCu and Al2Cu. With the increase of annealing temperature, the tensile strength of the composite decreases and the elongation shows a different variation which increases … Show more

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Cited by 19 publications
(4 citation statements)
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“…When the annealing temperature increases from 460 • C to 540 • C, the grain of Er metal grows slowly, and the hardness decreases from 134.47 HV to 98.03 HV rapidly. This is due to the dislocation density decreases and the stored energy of microstructure decreases during the recovery and recrystallization process [34,35]. As the annealing temperature increases above 540 • C, the hardness tends to be steady and the average grain size rapidly increases from 5.43 µm at 540 • C 21.52 µm at 700 • C, which is due to the internal stress disappearing and the energy of annealing completely transforms into grain growth.…”
Section: The Influence Of Cold Rolling Deformation On the Microstruct...mentioning
confidence: 99%
See 1 more Smart Citation
“…When the annealing temperature increases from 460 • C to 540 • C, the grain of Er metal grows slowly, and the hardness decreases from 134.47 HV to 98.03 HV rapidly. This is due to the dislocation density decreases and the stored energy of microstructure decreases during the recovery and recrystallization process [34,35]. As the annealing temperature increases above 540 • C, the hardness tends to be steady and the average grain size rapidly increases from 5.43 µm at 540 • C 21.52 µm at 700 • C, which is due to the internal stress disappearing and the energy of annealing completely transforms into grain growth.…”
Section: The Influence Of Cold Rolling Deformation On the Microstruct...mentioning
confidence: 99%
“…creases and the stored energy of microstructure decreases during the recovery and recrystallization process [34,35]. As the annealing temperature increases above 540 °C, the hardness tends to be steady and the average grain size rapidly increases from 5.43 µ m at 540 °C to 21.52 µ m at 700 °C, which is due to the internal stress disappearing and the energy of annealing completely transforms into grain growth.…”
Section: The Influence Of Cold Rolling Deformation On the Microstruct...mentioning
confidence: 99%
“…AuNPs were formed by a short annealing time and quenching or annealing . In addition, annealing and quenching can form a strong bond between the AuNPs and the substrate. Therefore, repeatable measurements can be performed comfortably without worrying about the AuNPs being wiped away. The final proposed SH-SAW device with AuNPs is depicted in Figure S5­(i).…”
Section: Experimental Sectionmentioning
confidence: 99%
“…At present, there are many methods to prepare Al/Cu bimetals, such as diffusion bonding [5], rolling bonding [6], transient liquid phase bonding [7] and continuous casting [8]. Among all the above-mentioned methods, continuous casting is a promising technique with good metallurgical bonding, low cost and high efficiency.…”
Section: Introductionmentioning
confidence: 99%