Effect of Bonding Time and Bonding Temperature on Lead-Free Solder Joints Dispersed Pillar Shaped IMCs

Hayashi, Yuriko; Nakata, Yoshihiro; Shohji, Ikuo; Koyama, Satoshi; Hashimoto, Tomihito

doi:10.1016/j.proeng.2017.04.088

Cited by 2 publications

(5 citation statements)

References 16 publications

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“…In this study, a Sn-3.0Ag-0.7Cu-5.0In (mass%) alloy was prepared as a solder material. The solidus and liquidus temperatures of Sn-3.0Ag-0.7Cu-5.0In are 206.2 and 214.6 o C, respectively [3]. Fig.…”

Section: Methodsmentioning

confidence: 87%

“…After etching treatment, morphology of IMCs was observed using the EPMA. Observed microstructures were compared to that of the previous joint formed at the cooling rate of 2.0 o C/s [3]. Furthermore, a die shear test was conducted to investigate joint strength.…”

Section: Methodsmentioning

confidence: 99%

“…In a power module that is required larger area bonding compared to general electronic components, suppression of crack growth in a solder joint is effective to improve the reliability of the joint. The authors have developed the solder joint with pillar-shaped intermetallic compounds (IMC) for automotive applications to suppress the progress of the crack [2][3][4]. In the previous study, the effect of bonding conditions on the formation of pillar-shaped Cu-Sn IMCs was researched with several lead-free solder [2].…”

Section: Introductionmentioning

confidence: 99%

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Effect of Cooling Rate on Intermetallic Compounds Formation in Sn-Ag-Cu-In Solder

Miki

Kobayashi

Shohji

et al. 2018

MSF

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The effect of the cooling rate in bonding on IMCs formation and their morphology in the solder joint with Sn-3.0Ag-0.7Cu-5.0In (mass%) lead-free solder was investigated. As the substrate, the Cu plate and the Cu plate with electroplated Ni were prepared. Bonding was conducted in the vacuum atmosphere, and bonding temperature and time were 300°C and 10 minutes, respectively. The cooling rates in the bonding were changed from 0.02°C/s to 0.2°C/s. In both Cu/Cu and Cu/Ni joints, scallop-shaped IMCs form at the joint interfaces regardless of the cooling rate. In the Cu/Cu joint, Cu6(Sn,In)5 and Cu3(Sn,In) layers form at the joint interface. In the Cu/Ni joint, (Cu,Ni)6(Sn,In)5 and (Cu,Ni)3(Sn,In) layers form at the joint interface with Cu and the (Cu,Ni)6(Sn,In)5 layer forms at the joint interface with Ni. Die shear force of the Cu/Ni joints are a little larger than those of the Cu/Cu joints. Fracture occurs in the boundary between the scallop-shaped layer or the granular IMC layer and the layered IMC in both joints. The cooling rate from the peak temperature to solidification is an important factor to decide the shape of formed IMC. When the cooling rate is high and supercooling becomes large, formation of pillar-shaped IMCs occurs easily.

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Section: Methodsmentioning

confidence: 87%

Section: Methodsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Effect of Cooling Rate on Intermetallic Compounds Formation in Sn-Ag-Cu-In Solder

Miki

Kobayashi

Shohji

et al. 2018

MSF

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“…In order to improve the reliability of the large area junction, it is important to suppress the progress of the cracks, and we have studied strengthening by the pillar shaped IMCs in the joint [4]. When Cu is present at least at one side of the substrate even if the other side substrate material is Cu or Ni, Cu dissolves in molten solder and the pillar shaped IMCs crystallize in the cooling process of joining.…”

Section: Introductionmentioning

confidence: 99%

“…When Cu is present at least at one side of the substrate even if the other side substrate material is Cu or Ni, Cu dissolves in molten solder and the pillar shaped IMCs crystallize in the cooling process of joining. As the pillar shaped IMCs, Cu 6 Sn 5 is formed in the joint with Sn-3.0Ag-0.5Cu (SAC305), (Cu,Ni) 6 Sn 5 is done in the joint with a Ni plated electrode, and Cu 6 (Sn,In) 5 is formed in the joint with solder including In [4]. It has been revealed that the formation amount of pillar shaped IMCs depends on the temperature, and they are 3.5% and 5.5% at the joining temperature of 300°C and 330°C, respectively [5].…”

Section: Introductionmentioning

confidence: 99%

A Study on Reliability of Pillar-Shaped Intermetallic Compounds Dispersed Lead-Free Solder Joint

Nakata¹,

Kurasawa²,

Hashimoto³

et al. 2018

MSF

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A pillar shaped intermetallic compounds (IMCs) dispersed solder joint is a highly durable joint to achieve large area joining. The aim of this study is to investigate the ideal dispersion amount of pillar shaped IMCs. The dispersion rate of pillar shaped IMCs depend on the joining temperature. Pillar shaped IMCs dispersion rates are 3.5% and 5.5% when the joining temperature are 300 °C and 330 °C, respectively. Longitudinal elastic modulus are improved by forming pillar shaped IMCs. As a result of examination of the durability by the thermal cycle test, the durability of the joint with the dispersion rate of 3.5% was similar to that without pillar shaped IMCs, while that with the dispersion rate of 5.5% was remarkably improved. In the case of the dispersion rate of 3.5%, pillar shaped IMCs unevenly distributed and cracks tend to progress. On the other hand, in the case of the dispersion rate of 5.5%, pillar shaped IMCs were uniformly dispersed throughout the joint and suppressed crack propagation. Comparison of durability between pillar shaped IMCs solder and indium added solder to verify the effect of pillar shaped IMCs demonstrated that pillar shaped IMCs solder were more durable than indium added solder.

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Effect of Bonding Time and Bonding Temperature on Lead-Free Solder Joints Dispersed Pillar Shaped IMCs

Cited by 2 publications

References 16 publications

Effect of Cooling Rate on Intermetallic Compounds Formation in Sn-Ag-Cu-In Solder

Effect of Cooling Rate on Intermetallic Compounds Formation in Sn-Ag-Cu-In Solder

A Study on Reliability of Pillar-Shaped Intermetallic Compounds Dispersed Lead-Free Solder Joint

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