2017
DOI: 10.1016/j.jallcom.2017.01.091
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Effect of bonding time on the joint properties of transient liquid phase bonding between Ti--6Al--4V and AISI 304

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Cited by 52 publications
(6 citation statements)
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“…e content of the TiFe phase is less than that of the CuTi phase, which is due to the fact that the diffusion rate of Ti in Cu is higher than that of Fe in Cu, thus declining the brittleness of joints [72]. Norouzi et al [73] also studied the effect of bonding time on the property of the transient liquid-phase bonded joints with copper as the interlayer. e time required for complete isothermal solidification can be calculated by [71,74]…”
Section: Cu Interlayermentioning
confidence: 99%
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“…e content of the TiFe phase is less than that of the CuTi phase, which is due to the fact that the diffusion rate of Ti in Cu is higher than that of Fe in Cu, thus declining the brittleness of joints [72]. Norouzi et al [73] also studied the effect of bonding time on the property of the transient liquid-phase bonded joints with copper as the interlayer. e time required for complete isothermal solidification can be calculated by [71,74]…”
Section: Cu Interlayermentioning
confidence: 99%
“…where W max is the maximum liquid width proportional to the initial interlayer thickness, K is a constant, and D is the solute diffusivity in the base metal. As the bonding time increases to 60 min, the amount of the intermetallic compound was decreased and only single-phase solid solution β-Ti existed at the interface, which gives rise to a maximum shear strength of 374 MPa [73]. Zakipour et al [75,76] investigated the influence of Cu interlayer's thickness on diffusion bonding behavior of stainless steel 316/Ti-6Al-4V system.…”
Section: Cu Interlayermentioning
confidence: 99%
“…The formation of TiCu and Ti 2 Cu instead of α+β-Ti and Ti 2 Cu in the bonding zone can be attributed to the insufficient holding time for the isothermal solidification. Norouzi et al [17] demonstrated that the eutectic and intermetallics compounds could be obtained in TLP bonding of TC4/steel with Cu foil if the holding time was insufficient for the completion of isothermal solidification.…”
Section: Microstructure Of Joint With Cu Foilmentioning
confidence: 99%
“…The diffusion bonding of Ti–6Al–4V to 304 stainless steel through 25 μm thick copper interlayer at 950 °C resulted in shear strength growing with the bonding time and reaching the maximum of 374 MPa at 60 min . Reaction interfaces contained ( β ‐Ti), Ti 2 Cu, Ti 2 Cu 3 , TiCu 2, TiCu 4 , CuTi, and FeTi phases for the bonding time of 45 min, however at 60 min, the interface contained mainly a ( β ‐Ti) solid solution, which was attributed to isothermal solidification.…”
Section: Joining With Intermediate Materials That Forms Intermetallic mentioning
confidence: 99%