SiC ceramics can be pressureless solid-state (PSS) sintered with elemental B or B-compounds and C as sintering aids. The sintering mechanism is a solid-state diffusion process where B segregates at the grain boundaries and reduces the grain boundary energy (γ gb ) 1−3 and C increases the surface energy (γ sv ) of SiC by removing the native SiO 2 film via a carbothermal reduction process. The combined action reduces γ gb /γ sv to a subcritical value and the densification process becomes thermodynamically feasible. 1,2 PSS SiC ceramics exhibit high oxidation and corrosion resistance, high hardness, excellent wear resistance, good strength retention at elevated temperatures, high creep resistance, high thermal conductivity, and low thermal expansion. 2−7 Unlike liquid-phase sintered SiC ceramics where the mechanical, thermal, and electrical properties can be tuned using a wide range of additive systems, 8−11 the scope of PSS SiC ceramics is constrained by the limited choice of sintering additives. To harness the full potential of PSS SiC ceramics, it is important to explore new additives and processing strategies to tailor the properties of PSS SiC ceramics.One potential strategy is to add AlN to PSS SiC. AlN at 2-100 wt% is known to form a solid-solution with SiC. 12 Recently, Li et al. 5 and Zhang et al. 7 investigated the effect of AlN addition on the mechanical and thermal properties of SiC ceramics pressureless sintered with B 4 C and C. SiC-4.6 wt% AlN exhibited the highest flexural strength (392 MPa) and fracture toughness (4.5 MPa‧m 1/2 ) among the SiC-0.9-22.3 wt% AlN ceramics sintered at 2130°C in Ar with 0.7-0.9 wt% B 4 C and 2.7-3.6 wt% C. 5 The optimal AlN content was a trade-off between improved densification caused by AlN addition and increased residual porosity due to partial decomposition of AlN during sintering. The thermal conductivity monotonically decreased (123 → 46 Wm −1 K −1 ) with increasing (0.5 → 10 wt%) AlN