Abstract:The effect of curing process on the warpage of encapsulated electronic package is considered by using a coupled chemical-thermo-mechanical modeling methodology. A cure-dependent constitutive model that consists of a cure kinetics model, a curing and chemical aging induced shrinkage model and a degree of cure-dependent viscoelastic relaxation model was implemented in a numerical finite element model for warpage simulation. Effects of polymerization conversion and chemical aging on the warpage evolution of a bim… Show more
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