2011 IEEE 61st Electronic Components and Technology Conference (ECTC) 2011
DOI: 10.1109/ectc.2011.5898774
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Effect of chemical aging on warpage for encapsulated packages — Characterization and simulation

Abstract: The effect of curing process on the warpage of encapsulated electronic package is considered by using a coupled chemical-thermo-mechanical modeling methodology. A cure-dependent constitutive model that consists of a cure kinetics model, a curing and chemical aging induced shrinkage model and a degree of cure-dependent viscoelastic relaxation model was implemented in a numerical finite element model for warpage simulation. Effects of polymerization conversion and chemical aging on the warpage evolution of a bim… Show more

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