Effect of copper concentration in printable copper inks on film fabrication

Electrically conductive copper film prepared at low temperature by thermal decomposition of copper amine complexes with various amines

“…In order to improve the conductivity of the film, 2 sizes of particles were used [24]. The addition of copper particles to the ink was effective; however, impurities covering the surface of the copper particles increased the resistivity.…”

“…In view of these points, the formation of electrically conductive film by thermal decomposition of copper-amine complexes calcined at low temperatures was promising. Precursor-type copper inks were formulated by mixing copper(II) formate and hexylamine, resulting in the lowest electrical resistivity of 5.2 Â 10 À6 V cm by annealing at 200 8C for 2 min followed by reduction with formic acid gas at 250 8C for 2 min [24]. We report that the preparation of electrically conductive copper film at low temperature was accomplished by the thermal decomposition of copper-amine complexes without organic residue, resulting in the lowest resistivity of 2 Â 10 À5 V cm by calcination at 140 8C [25].…”

Effect of the Amine Concentration on Phase Evolution and Densification in Printed Films Using Cu(II) Complex Ink

“…16 Yabuki et al showed that the size of the formed Cu nanoparticles was dependent upon the type of amine used in the Cu(II) complex ink. 17 However, their phenomenological results could be not explained clearly with a cause-and-effect relationship because no mechanistic investigation correlating ink chemistry with phase evolution and microstructure formation was performed in their works.…”

Copper Electrode Material using Copper Formate-Bicarbonate Complex for Printed Electronics

“…Conductive electrode or pad can be prepared from various forms; metallic nanoparticles, [2][3][4] conductive polymers, 5 and organo-metallic compounds. 6,7 In the case of nanoparticles, they may be easily aggregated when re-dispersed in solvents. Furthermore, they are usually synthesized in smaller scale, need a particular storage condition, and are more expensive.…”

“…Oxidation can be prevented by avoiding copper to be in contact with oxygen by adding various capping agents in the formulation of the inks. [12][13][14][15] Moreover, different reduction methods were also adapted such as laser sintering [16][17][18] and calcination in nitrogen, 19 hydrogen, 20,21 and formic acid 7 atmospheres. In this study, conductive inks were prepared by forming complexes of copper(II) formate and 2-ethyl-1-hexylammonium bicarbonate (EHABC).…”