Effect of crystal structure of nickel substrates on interfacial behaviors in Sn/Ni soldered joints

Yang, Ming; Chen, Jie Shi; Yang, Jin; Zhang, Peilei; Yu, Zhi Shui; Zeng, Zhi; Yu, Chun; Lü, Hao

doi:10.1016/j.matlet.2020.128424

Cited by 6 publications

(2 citation statements)

References 13 publications

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“…The XRD pattern analysis of the IMC layer in Figure 5(a) shows that the IMC layer with polycrystalline Ni as the substrate was the Ni 3 Sn 4 phase. Figure 5(b) shows the XRD pattern of the IMCs layer with single-crystal Ni as the substrate (Yang et al, 2020b). By comparing the ideal structure of PtSn4 and b -IrSn4, it was found that the diffraction pattern tested by XRD showed a narrow Bragg reflection and a characteristic wide diffraction band indicating stacking disorder in the NiSn 4 crystal structure.…”

Section: Sn-xni/ni (Pc/sc) Solid-liquid Interfacial Reactionmentioning

confidence: 99%

“…In the trend of electronic packaging technology, Ni and Ni-based alloys have become common coating materials in ball grid array microelectronic packaging, owing to the fact that the Ni layer serves as a diffusion barrier layer that can reduce the interfacial reactions between solder alloys and Cu substrates (Zhang et al, 2021;Kim et al, 1999;Chiang et al, 2004). Therefore, the interfacial reactions and IMC growth between Sn-based solder and Ni or Ni-containing substrates have been of interest to many researchers for a long time (Laurila et al, 2006;Li et al, 2015;Yang et al, 2020b;Xu et al, 2019;Os orio et al, 2013). For instance, He et al (2006) reported that the thickness of the IMC increased with an increase in Cu content when soldered with Ni at 260°C and at the same time, the composition and morphology of the IMC had notable changes.…”

Section: Introductionmentioning

confidence: 99%

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Effects of doping trace Ni element on interfacial behavior of Sn/Ni (polycrystal/single-crystal) joints

Wang¹,

Chen²,

Zhang³

et al. 2021

SSMT

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Purpose The purpose of this article is the effect of doping minor Ni on the microstructure evolution of a Sn-xNi (x = 0, 0.05 and 0.1 wt.%)/Ni (Poly-crystal/Single-crystal abbreviated as PC Ni/SC Ni) solder joint during reflow and aging treatment. Results showed that the intermetallic compounds (IMCs) of the interfacial layer of Sn-xNi/PC Ni joints were Ni3Sn4 phase, while the IMCs of Sn-xNi/SC Ni joints were NiSn4 phase. After the reflow process and thermal aging of different joints, the growth behavior of interfacial layer was different due to the different mechanism of element diffusion of the two substrates. The PC Ni substrate mainly provided Ni atoms through grain boundary diffusion. The Ni3Sn4 phase of the Sn0.05Ni/PC Ni joint was finer, and the diffusion flux of Sn and Ni elements increased, so the Ni3Sn4 layer of this joint was the thickest. The SC Ni substrate mainly provided Ni atoms through the lattice diffusion. The Sn0.1Ni/SC Ni joint increases the number of Ni atoms at the interface due to the doping of 0.1Ni (wt.%) elements, so the joint had the thickest NiSn4 layer. Design/methodology/approach The effects of doping minor Ni on the microstructure evolution of an Sn-xNi (x = 0, 0.05 and 0.1 Wt.%)/Ni (Poly-crystal/Single-crystal abbreviated as PC Ni/SC Ni) solder joint during reflow and aging treatment was investigated in this study. Findings Results showed that the intermetallic compounds (IMCs) of the interfacial layer of Sn-xNi/PC Ni joints were Ni3Sn4 phase, while the IMCs of Sn-xNi/SC Ni joints were NiSn4 phase. After the reflow process and thermal aging of different joints, the growth behavior of the interfacial layer was different due to the different mechanisms of element diffusion of the two substrates. Originality/value In this study, the effect of doping Ni on the growth and formation mechanism of IMCs of the Sn-xNi/Ni (single-crystal) solder joints (x = 0, 0.05 and 0.1 Wt.%) was investigated.

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Section: Sn-xni/ni (Pc/sc) Solid-liquid Interfacial Reactionmentioning

confidence: 99%