Effect of Cu<sup>2+</sup>Concentration and Additives on Properties of Electrodeposited Cu Thin Films for FCCL from Sulfate Baths

Shin, Dong-Yul; Park, Doek-Yong; Koo, Bon‐Heun

doi:10.5695/jkise.2009.42.5.191

Journal of the Korean institute of surface engineering

2009

DOI: 10.5695/jkise.2009.42.5.191

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Effect of Cu²⁺Concentration and Additives on Properties of Electrodeposited Cu Thin Films for FCCL from Sulfate Baths

Dong-Yul Shin¹,

Doek-Yong Park²,

Bon‐Heun Koo³

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Influence of Chemical Composition of Pyrophosphate Copper Baths on Properties of Electrodeposited Cu Films

신동율¹,

Koo²,

Park³

2015

Journal of the Korean Electrochemical Society

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: Effects of chemical composition (Cu 2+, K 4 P 2 O 7 and additive concentrations) of baths on properties of Cu thin films electrodeposited from pyrophosphate copper bath were investigated. Current efficiency was increased to be near 100% with increasing Cu 2+ concentrations from 0.02 to 0.3 M. Decrease of current efficiency was observed in the range of 1.5~1.8 M K 4 P 2 O 7 concentration, but current efficiency of about 100% was measured in the ranges of both 0.9~1.3 M and 2.1~2.4 M. The change of additive concentration did not influenced current efficiency. Residual stress of electrodeposited Cu thin films was measured to be about 20 MPa below 0.15 M Cu 2+ concentration and increased with the increase of it to 0.25 M. Maximum residual stress of 120 MPa was observed at 0.25 M Cu 2+ concentration. On the other hand, residual stress decreased from 80 to near 0 MPa as K 4 P 2 O 7 concentration varied from 0.9 to

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Influence of Chemical Composition of Pyrophosphate Copper Baths on Properties of Electrodeposited Cu Films

신동율¹,

Koo²,

Park³

2015

Journal of the Korean Electrochemical Society

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A Study on Rotary Type Embossing Process System for Spacer Tape Production

Han¹,

Kim²,

Lee³

2012

Journal of the Korea Academia-Industrial cooperation Society

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Recently, component materials for display are being developed into higher value-added industries which can strengthen national industrial competitiveness. However, a system for production of component materials for display is nearly depending on import, and its development level is inadequate. For this reason, localization of the embossing treatment system for production of the spacer tape and system improvement for increasing of productivity are needed. Therefore, in this paper, we propose rotary type embossing process system for spacer tape production for localization of system and increasing productivity. The system consists of unwinding, forming, cleaning, winding and testing parts. The mold of forming part is designed to rotary type. And we designed each part and made a prototype to test its performance. We measured embossing shapes, diameter and distance between each embossing and opposite embossing using three coordinate measuring machine. Also, we measured impurity level and the number of impurity particles of sample through the testing and cleaning part. Additionally, the productivity of spacer tape produced by the prototype is measured.

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Effect of Cu²⁺Concentration and Additives on Properties of Electrodeposited Cu Thin Films for FCCL from Sulfate Baths

Cited by 2 publications

References 5 publications

Influence of Chemical Composition of Pyrophosphate Copper Baths on Properties of Electrodeposited Cu Films

Influence of Chemical Composition of Pyrophosphate Copper Baths on Properties of Electrodeposited Cu Films

A Study on Rotary Type Embossing Process System for Spacer Tape Production

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Effect of Cu2+Concentration and Additives on Properties of Electrodeposited Cu Thin Films for FCCL from Sulfate Baths

Cited by 2 publications

References 5 publications

Influence of Chemical Composition of Pyrophosphate Copper Baths on Properties of Electrodeposited Cu Films

Influence of Chemical Composition of Pyrophosphate Copper Baths on Properties of Electrodeposited Cu Films

A Study on Rotary Type Embossing Process System for Spacer Tape Production

Contact Info

Product

Resources

About

Effect of Cu²⁺Concentration and Additives on Properties of Electrodeposited Cu Thin Films for FCCL from Sulfate Baths