Effect of cure shrinkage of epoxy molding compound on warpage behavior of semiconductor package

Baek, Jeong-Hyeon; Park, Dong-Woon; Oh, Gyung-Hwan; Kawk, Dong-Ok; Park, Simon S.; Kim, Kwang Ho

doi:10.1016/j.mssp.2022.106758

Cited by 16 publications

(3 citation statements)

References 31 publications

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“…In particular, around the glass transition temperature region, the modulus decreased drastically with respect to time. 64,65 Thus, it is difficult to conclude that the modulus drop at 190 °C represents T g . When all the results are put together, it can be seen that the T g of this EMC exists at over 205 °C.…”

Section: Generalized Total Strain−life Fatigue Modelmentioning

confidence: 99%

Thermal Shock Life Prediction of the SiC Wide Bandgap Power Module Semiconductor Package Considering Creep Behavior of the Ag Sintered Interconnect and Viscoelastic Properties of the Epoxy Molding Compound

Jang,

Park,

Baek

et al. 2023

ACS Appl. Electron. Mater.

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In this study, the thermal shock life cycle of a wide bandgap (WBG) power module was predicted using finite element analysis considering the thermal fatigue/creep deformation of Ag sintered joints and the viscoelastic properties of epoxy molding compounds (EMCs) under periodic thermal shock conditions. To analyze the thermomechanical behaviors of the WBG power module, creep tests were carried out under continuous shear loading to evaluate the creep properties of Ag sintered joints depending on the temperature and shear stress. Also, the viscoelastic properties of fully cured EMCs were measured by conducting three-point bending stress relaxation tests. The stress/strain distributions of the power module package during the thermal shock cycles were predicted. Finally, the failure life cycle of the Ag sintered joints was calculated using the total strain–life equation based on the results of the thermal fatigue experiments. Thermal shock tests of the manufactured WBG power module were conducted to confirm the thermal fatigue cycle at which the Ag sintered joints began to be damaged. It was concluded that the failure life cycle of Ag sintered joints could be accurately predicted using the finite element (FE) simulations considering the creep and thermal fatigue properties of the Ag interconnect and the viscoelastic behavior of EMCs.

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Section: Generalized Total Strain−life Fatigue Modelmentioning

confidence: 99%

Thermal Shock Life Prediction of the SiC Wide Bandgap Power Module Semiconductor Package Considering Creep Behavior of the Ag Sintered Interconnect and Viscoelastic Properties of the Epoxy Molding Compound

Jang,

Park,

Baek

et al. 2023

ACS Appl. Electron. Mater.

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“…Generally, at the end of the curing, polymers, and polymeric composite components show part warpage and distortions [16] originating from residual stresses arising during Polymers 2024, 16, 1541 2 of 15 manufacturing [1,17,18]. These issues often reduce the theoretical mechanical properties and necessitate further re-manufacturing, which can be expensive in terms of both costs and time.…”

Section: Introductionmentioning

confidence: 99%

“…Since epoxy has unique properties in adhesion, strength, toughness, and processability, it is used in many different sectors nowadays. Epoxy’s components are utilized in electric and electronic applications as packaging for electronic devices [ 1 , 2 ], adhesives [ 3 , 4 ], coating [ 5 ], and so on [ 6 , 7 ]. In addition, epoxy resins are the most used matrices for carbon and glass fiber composites, employed mainly in aerospace [ 8 , 9 ].…”

Section: Introductionmentioning

confidence: 99%

A Numerical Model to Predict the Relaxation Phenomena in Thermoset Polymers and Their Effects on Residual Stress during Curing, Part II: Numerical Evaluation of Residual Stress

Verde,

D’Amore,

Grassia

2024

Polymers

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This article proposes a numerical routine to predict the residual stresses developing in an epoxy component during its curing. The scaling of viscoelastic properties with the temperature and the degree of conversion is modeled, adopting a mathematical formulation that considers the concurrent effects of curing and structural relaxation on the epoxy’s viscoelastic relaxation time. The procedure comprises two moduli: at first, the thermal–kinetical problem is solved using the thermal module of Ansys and a homemade routine written in APDL, then the results in terms of temperature and the degree of conversion profiles are used to evaluate the viscoelastic functions, and the structural problem is solved in the mechanical module of Ansys, allowing the residual stresses calculation. The results show that the residual stresses mainly arise during cooling and scale with the logarithm of the Biot number.

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Effects of curing condition and solder mask on substrate warpage: an experimental and simulation study

Fan,

Hu,

et al. 2024

J Mater Sci: Mater Electron

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Effect of cure shrinkage of epoxy molding compound on warpage behavior of semiconductor package

Cited by 16 publications

References 31 publications

Thermal Shock Life Prediction of the SiC Wide Bandgap Power Module Semiconductor Package Considering Creep Behavior of the Ag Sintered Interconnect and Viscoelastic Properties of the Epoxy Molding Compound

Thermal Shock Life Prediction of the SiC Wide Bandgap Power Module Semiconductor Package Considering Creep Behavior of the Ag Sintered Interconnect and Viscoelastic Properties of the Epoxy Molding Compound

A Numerical Model to Predict the Relaxation Phenomena in Thermoset Polymers and Their Effects on Residual Stress during Curing, Part II: Numerical Evaluation of Residual Stress

Effects of curing condition and solder mask on substrate warpage: an experimental and simulation study

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