Effect of elastic recovery on the electrical contact resistance in anisotropic conductive adhesive assemblies

Chin, Melida; Barber, J. R.; Hu, Siqing

doi:10.1109/tcapt.2005.853166

Cited by 18 publications

(11 citation statements)

References 10 publications

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“…Table 2 truthfully reflect the curing degree about the properties of conductive adhesive interconnection. When temperature determined, the higher the curing degree, the greater the contact area of conductive particles, as the results of the literature [5] and [10]. …”

Section: A the Influence Of Curing Degree Of Conductive Particles Resupporting

confidence: 66%

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Effect of Curing Temperature and Curing Degree on Elastic Recovery of Conductive Particles

Gong¹,

Zhou²

2015

Proceedings of the 2015 Asia-Pacific Energy Equipment Engineering Research Conference

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Abstract-The nonlinear properties of elastic modulus of the resin in relation to curing degree of the resin was defined through the phenomenological model. The finite element model of LTCC-metal assembly, which belong to the radio frequency (RF) function layer, is established by ABAQUS. When curing pressure is determined, the effect of different curing degree on the elastic recovery of conductive particles is given under the same curing temperature, and the influence of different curing temperature on the deformation of conductive particle is also given under the same curing degree. Therefore, the curing degree increased is able to increase the contact area of conductive particles so as to reduce the contact resistance, but at the same time, the interconnection interface residual stress also increased, thus easy to cause the stratification. However, when the curing degree is determined, the contact area increased firstly, and then gradually decrease as the curing temperature increases, and when used in curing at lower temperature, the curing time increased accordingly, it will influence the economic benefits.

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Section: A the Influence Of Curing Degree Of Conductive Particles Resupporting

confidence: 66%

“…As shown in Fig. 1, conductive particles and the cured resin simplified into springs [5]. Conductive adhesive interconnection process can be understood as conductive particles hot-pressing formed and rebound of conductive particles.…”

Section: Research Approachesmentioning

confidence: 99%

Effect of Curing Temperature and Curing Degree on Elastic Recovery of Conductive Particles

Gong¹,

Zhou²

2015

Proceedings of the 2015 Asia-Pacific Energy Equipment Engineering Research Conference

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“…Fig. 12(a)-(b) present schematic figures of the stress field around the conductive particles during the bonding process and the temperature increase in the reflow testing, respectively [19]. As shown in Fig.…”

Section: Resultsmentioning

confidence: 99%

Analysis of Failure Mechanism in Anisotropic Conductive and Non-Conductive Film Interconnections

Kim

Kim²,

Lee

et al. 2008

IEEE Trans. Comp. Packag. Technol.

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Failure behaviors of anisotropic conductive film (ACF) and non-conductive film (NCF) interconnects were investigated by measuring the connection resistance. The four-point probe method was used to measure the connection resistance of the adhesive joints constructed with Au bump on Si chip and Cu pad on flexible printed circuit. The interconnection reliability was evaluated by multiple reflow process. The connection resistance of the ACF joints was markedly higher than that of NCF joints, mainly due to the constriction of the current flow and the intrinsic resistance of the conductive particles in ACF joints. The connection resistances of both interconnections decreased with increasing bonding force, and subsequently converged to about 10 and 1 m at a bonding force of 70 and 80 N, for the ACF and NCF joints, respectively. During the reflow process, two different conduction behaviors were observed: increased connection resistance and the termination of Ohmic behavior. The former was due to the decreased contact area caused by -directional swelling of the adhesives, whereas the latter was caused by either contact opening in the adhesive joints or interface cracking.

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“…Delamination, defined here as the separation of the surface layer from the solid body, is observed in many engineering processes and natural phenomena, ranging from surface buckling of layered composites (e.g., [1][2][3]56]) to surface fracturing caused by hydrogen embrittlement in metals (e.g., [4][5][6]). For example, in the case of pipelines for hydrocarbon transport (e.g., [7,8]), anti-corrosion, polymer coating sometimes results in more frequent appearance of small scale delaminations [9].…”

Section: Introductionmentioning

confidence: 99%

Asymptotic approach to the constant velocity of hydrogen delamination growth

Balueva

2008

International Journal of Mechanical Sciences

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Effect of elastic recovery on the electrical contact resistance in anisotropic conductive adhesive assemblies

Cited by 18 publications

References 10 publications

Effect of Curing Temperature and Curing Degree on Elastic Recovery of Conductive Particles

Effect of Curing Temperature and Curing Degree on Elastic Recovery of Conductive Particles

Analysis of Failure Mechanism in Anisotropic Conductive and Non-Conductive Film Interconnections

Asymptotic approach to the constant velocity of hydrogen delamination growth

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