Effect of Electrodeposition Conditions on Surface Roughness of Copper Electroformed Replicas

Abstract

With recent developments in ultraprecision machining methods, the manufacture of devices with sub-10 nm shape accuracy and with surface smoothness at the atomic level has been realized. However, it takes a lot of work and time to fabricate such precise devices. Electroforming, a replication technique using electrodeposition, is expected to be an efficient fabrication process for these device s. In this paper, we report fundamental research on electroform replication of ultra-smooth masters. Smooth float glass substrates that have a root-mean-square surface roughness of 0.1 nm were used as masters. Copper electroformed replicas were fabricated to investigate the relationship between electrodeposition conditions and surface roughness of the replicas. Experimental results indicate that the microstructures of the electroplated films affect the surface roughness of replicas.

Localized and Mask-less Copper Deposition with Free-flow Jet Micro-Electrochemical Additive Manufacturing

“…Since ECAM is essentially the reverse of ECM, this trend still holds and Sa (Figure 5 a) decreased with an increase in current density in this study. This trend was also observed by Yamaguchi et al 13) in Cu electroforming. Sdr defines the…”