Effect of electromigration on diffusional creep in polycrystalline materials

Abstract

An analysis was made of the diffusional creep in polycrystalline materials when subjected to simultaneous action of tensile stress and electric current. Incorporating the contribution of electromigration to atomic diffusion in grain boundaries, the problem of grain boundary diffusion was solved. A simple relationship was derived between diffusional creep rate and local electric field intensity (current density). The results showed that electromigration can enhance the diffusional creep in polycrystalline materials.

Effects of electromigration on the creep of Sn0.3Ag0.7Cu solder joint

“…Liu H. Y. et al [10] reported stress-relaxation rate of tin-based solder joint increased significantly after current stressing. Pharr M. et al [11] and Shao, S. S. et al [12] analyzed and discussed the effect of EMinduced diffusion on creep behavior based on theoretical calculation. These literatures demonstrated that when analyzing creep of a real solder joint, EM must be taken into account because of the interaction between them.…”

Analytical Description of the Steady-State Creep of Metals in the Presence of Direct Current

“…(iii) The intensification of the current field assisted sliding rate and diffusional creep [14][15][16] Such metals and their alloys as copper, nickel, aluminum, tin, etc. [1][2][3]6] show the increase in their steady-state creep due to the passage of direct current (DC).…”