Effect of electromigration on interfacial reactions between electroless Ni-P and Sn–3.5% Ag solder

Kumar, Aditya; He, Min; Chen, Zhong; Teo, Poi-Siong

doi:10.1016/j.tsf.2004.05.042

Cited by 50 publications

(41 citation statements)

References 16 publications

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“…On the other hand, in the electroless Ni-P/ Sn-3.5Ag system, as reported in our previous work, 31 Ni 3 Sn 4 grows at the interface between itself and a ternary Ni-Sn-P compound. Ni comes from the electroless Ni-P layer through the Ni 3 P and Ni-Sn-P layers and Sn comes from the solder through the Ni 3 Sn 4 layer.…”

Section: Effect Of Electric Current On Ni 3 Sn 4 Imc Growthsupporting

confidence: 81%

Effect of Electromigration on the Mechanical Performance of Sn-3.5Ag Solder Joints with Ni and Ni-P Metallizations

Kumar

Yang

Wong

et al. 2008

Journal of Elec Materi

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The effect of moderate electric current density (1 9 10 3 to 3 9 10 3 A/cm 2 ) on the mechanical properties of Ni-P/Sn-3.5Ag/Ni-P and Ni/Sn-3.5Ag/Ni solder joints was investigated using a microtensile test. Thermal aging was carried out at 160°C for 100 h while the current was passed. The interfacial microstructure and intermetallic compound (IMC) growth were analyzed. It was found that, at these levels of current density, there were no observable voids or hillocks. Samples aged at 160°C without current stressing failed mostly inside the bulk solder with significant prior plastic deformation. The passage of current was found to cause brittle failure of the solder joints and this tendency for brittle failure increased with increasing current density. Fractographic analysis showed that, in most of the electrically stressed samples, fracture occurred at the interface region between the solder and the joining metals. The critical current density that caused brittle fracture was about 2 9 10 3 A/cm 2 . Once brittle fracture occurred, the tensile toughness, defined as the energy per unit fractured area, was usually lower than $5 kJ/m 2 , compared with the case of ductile fracture where this value was typically greater than $9 kJ/m 2 . When comparing the two types of joint, the brittle failure was found to be more severe with the Ni than with the Ni-P joint. This work also found that the passage of electric current affects the IMC growth rate more significantly in the Ni than in the Ni-P joint. In the case of the Ni joint, the Ni 3 Sn 4 IMC at the anode side was appreciably thicker than that formed at the cathode side. However, in the case of electroless Ni-P metallization, this difference was much smaller.

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Section: Effect Of Electric Current On Ni 3 Sn 4 Imc Growthsupporting

confidence: 81%

Effect of Electromigration on the Mechanical Performance of Sn-3.5Ag Solder Joints with Ni and Ni-P Metallizations

Kumar

Yang

Wong

et al. 2008

Journal of Elec Materi

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“…15 Aside from these columnar voids, some investigators have also reported the occurrence of breaks in the P-rich layer, with sizes that are noticeably greater than the columnar voids. 11,16,18 Alam et al 11 have indicated that the stress generated during the crystallization of the amorphous electroless Ni-P layer is responsible for these breaks. Other researchers have explained this phenomenon in terms of a similar mechanism, where small columnar voids induced by the counter diffusion of vacancies lead to concurrent diffusion of Ni toward the IMC.…”

Section: Growth Of Imcs After Reflow Soldering and Agingmentioning

confidence: 99%

“…Other researchers have explained this phenomenon in terms of a similar mechanism, where small columnar voids induced by the counter diffusion of vacancies lead to concurrent diffusion of Ni toward the IMC. 18 The appearance of these defects in the P-rich layer was observed from TEM of the cross-sectioned sample. Figure 10a depicts the Ni-P layer beneath the P-rich layer.…”

Section: Growth Of Imcs After Reflow Soldering and Agingmentioning

confidence: 99%

“…However, the adverse changes in the reliability of the electroless Ni-P plating process cannot be ignored. From a review of recent literature on electroless Ni-P UBM/solder interfaces, 11,16,18,19 it is clear that most of the systems investigated in these studies exhibited irregular interfaces. This contrasts with the case of electrolytic Ni UBM, which exhibits a flat interface.…”

Section: Introductionmentioning

confidence: 99%

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Inhomogeneous Consumption of the Electroless Ni-P Layer at the Solder Joint Formed with Sn-3.5Ag-0.7Cu

2009

Journal of Elec Materi

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This report investigates the phenomenon of interfacial serration at the joint between Sn-3.5Ag-0.7Cu solder (SAC) and electroless Ni-P underbump metallization (UBM) during aging. For comparison, the interface between SAC and electrolytic Ni UBM was also examined under similar aging conditions. The joint in the electrolytic Ni/SAC sample showed a smooth, flat interface between the Ni and intermetallic compounds, even after a long aging time. In contrast, electroless Ni-P/SAC exhibited an irregular interface, the irregularity of which became more severe with increased aging time. This observed roughness was initiated by large breaks across the P-rich layer. The breaks were filled with the overlying Ni-Sn-P phase material, which provided an easier interdiffusion path for Ni and Sn in the opposite direction. As a result, the local consumption of the Ni(-P) layer was accelerated, and the interface was serrated. The local maximum consumption rate of the Ni-P layer, as calculated from the minimum thickness of this layer in each sample with aging time, was similar to that of an electrolytic Ni layer.

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“…[1][2][3] Of these benefits, the most valuable advantage for the recent trends of electronic products toward powerful multi-functionality and miniaturization, is the highest I/O capability. Because of this capability, the 3-D flip chip package has been widely adapted in the electronic industries.…”

Section: Introductionmentioning

confidence: 99%

Electromigration Behavior of through-Si-via (TSV) Interconnect for 3-D Flip Chip Packaging

Yang

Jung

2010

Mater. Trans.

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Effect of electromigration on interfacial reactions between electroless Ni-P and Sn–3.5% Ag solder

Cited by 50 publications

References 16 publications

Effect of Electromigration on the Mechanical Performance of Sn-3.5Ag Solder Joints with Ni and Ni-P Metallizations

Effect of Electromigration on the Mechanical Performance of Sn-3.5Ag Solder Joints with Ni and Ni-P Metallizations

Inhomogeneous Consumption of the Electroless Ni-P Layer at the Solder Joint Formed with Sn-3.5Ag-0.7Cu

Electromigration Behavior of through-Si-via (TSV) Interconnect for 3-D Flip Chip Packaging

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