2006
DOI: 10.1016/j.applthermaleng.2006.04.016
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Effect of electroplating on the thermal conductance of fin–tube interface

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Cited by 15 publications
(8 citation statements)
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“…It is reported that increase of the expanding ratio will reduce the tube-fin thermal contact resistance with large contact pressure (Jeong et al, 2006;Cheng and Madhusudana, 2006). But Tang et al (2009a) found that too large expanding ratio will cause the inclines of the fin plates.…”
Section: Introductionmentioning
confidence: 95%
“…It is reported that increase of the expanding ratio will reduce the tube-fin thermal contact resistance with large contact pressure (Jeong et al, 2006;Cheng and Madhusudana, 2006). But Tang et al (2009a) found that too large expanding ratio will cause the inclines of the fin plates.…”
Section: Introductionmentioning
confidence: 95%
“…Therefore, some of the researchers have undertaken studies taking into account the realistic fin-tube thermal contact and its impact on the thermal efficiency of heat exchangers. Aside from the experimental research aimed at estimating the thermal contact resistance [11,12], its value is also obtained through semiempirical methods, partly based on numerical analysis. Taler and Oclon [13] and Taler and Cebula [14] changed iteratively the value of contact resistance in their CFD model in such a way that the thermal and flow quantities obtained from the numerical solution agreed with the measured ones.…”
Section: Introductionmentioning
confidence: 99%
“…In order to improve the thermal performance of the tubeefin joining, evaluation methods of the TCC have been studied to optimize the tube expansion process. Cheng and Madhusudana [7] evaluated the TCR of tubeefin heat exchanger with direct method by measuring the temperature drop and heat flux across the interface. Generally, on study the TCR of the tubeefin interface, experimental measurements with specimen of heat exchanger are mostly adopted.…”
Section: Introductionmentioning
confidence: 99%