The Proceedings of Mechanical Engineering Congress, Japan
 2017
DOI: 10.1299/jsmemecj.2017.j2210303
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Effect of free-standing Al/Ni multilayer film on thermal resistance of reactively-bonded solder joints

Shunsuke Kanetsuki
1
,
Ryota Kamiya
2
,
Koichi Kuwahara3
et al.
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