To realize the practical use of reactively bonded solder joints for thermally sensitive devices such as MEMS and electrical modules, we quantitatively measure the thermal resistance of solder joints fabricated by Al/Ni self-propagating exothermic reaction. By the laser flash method with response function analysis, the influence of bonding pressure on the thermal resistance of the reactive joints is investigated. The thermal resistance of the joints obtained by 3 MPa bonding is higher than that by 20 MPa bonding. By cross-sectional scanning electron microscopy (SEM) observation, many voids are found in the vicinity of the interface between the reacted AlNi and bottom-side solder layers in 3 MPa joints. In 20 MPa joints, a Ni-rich AlNi intermetallic compound instead of voids is produced around the interface. For reducing the thermal resistance of the reactive joints, the void generation mechanism is discussed in light of SEM observation and electron probe microanalysis (EPMA) analysis results.

To reduce the thermal resistance of solder joints obtained by Al/Ni self-propagating exothermic reaction, we focus on the interface between the solder and the reactive Al/Ni multilayer before the reaction. We fabricate an Al/Ni film in which the outermost Al or Ni layer is deposited more thickly. By the laser flash method with response function analysis, the thermal resistance of the bonded specimens was measured in the case of thickening and non-thickening of the outermost layer. It is found that the resistance decreases with the thickness of the outermost layers, particularly the Ni layer. To investigate the influence of the amount of void on the resistance, scanning acoustic tomography (SAT), scanning electron microscope (SEM) observation, and field-emission electron probe micro-analysis (FE-EPMA) were carried out. Differences in the interfacial state between Ni-thickening and Al-thickening specimens are discussed in light of solder wettability, diffusion into the solder, and the type of intermetallic compound at the solder interface. It can be considered that thickening the outermost Ni layer has a great impact on decreasing the number of voids generated at the AlNi–solder interface even in low-pressure bonding, leading to reduction in the thermal resistance of solder joints.

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