Effect of graphene nano-sheets additions on the density, hardness, conductivity, and corrosion behavior of Sn–0.7Cu solder alloy

Lv, Yang; Yang, Wenchao; Mao, Jianqin; Li, Yitai; Zhang, Xinjiang; Zhan, Yongzhong

doi:10.1007/s10854-019-02538-9

Cited by 13 publications

(5 citation statements)

References 41 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…In the electronics packaging industry, the SnPb solder is widely used due to its excellent mechanical properties, creep resistance, and fatigue resistance . However, the toxicity of lead and lead compounds has caused widespread concern. , The Environmental Protection Agency lists lead and its compounds as one of the 17 chemicals that pose the greatest threat to human life and the environment . Many countries and regions such as the US, EU, and China have banned the use of lead in electronic packaging. , The Sn0.7Cu solder is considered as a proper substitute for the SnPb solder due to its low cost, high strength, and low resistivity .…”

Section: Introductionmentioning

confidence: 99%

“…1 However, the toxicity of lead and lead compounds has caused widespread concern. 2,3 The Environmental Protection Agency lists lead and its compounds as one of the 17 chemicals that pose the greatest threat to human life and the environment. 4 Many countries and regions such as the US, EU, and China have banned the use of lead in electronic packaging.…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Nickel Nanoparticle/Carbon Films as an Interlayer To Improve the Stability of Solder Joints

Lin

Gao

et al. 2023

ACS Appl. Nano Mater.

View full text Add to dashboard Cite

The growth of brittle intermetallic compounds (IMCs) generated between a solder and a substrate is crucial for the reliability of solder joints. Therefore, it is necessary to control the growth of IMCs at the interface. Herein, we propose a strategy with the nickel nanoparticle/carbon (Ni&C) films as an interlayer to improve the stability of the solder joint. After adding the interface with the Ni&C film and reflowing for 450 s, the growth of IMCs decreased by 41.05%. After reflowing for 450 and 2100 s, the grain size in the 300 s-Ni&C/Cu substrate decreased by 14.34 and 20.50%, respectively, compared with the pure Cu substrate. Furthermore, the Ni&C film changes the microstructure of the interface and the diffusion pattern of elements, thus reducing the number of Kirkendall voids. As the reflow time increases, the scalloped IMCs are transformed to be prismatic, which can be well explained by the Gibbs–Thomson effect. The synergistic effect between Ni and carbon in Ni&C can jointly control the interface reaction and the growth of IMCs, with the Ni&C film acting as an inert barrier to inhibit the growth of IMCs.

show abstract

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Nickel Nanoparticle/Carbon Films as an Interlayer To Improve the Stability of Solder Joints

Lin

Gao

et al. 2023

ACS Appl. Nano Mater.

View full text Add to dashboard Cite

show abstract

“…It has been reported that carbon-based materials (CNTs, GNS) and metal particles (Ni, Co, Ag, Bi, In) can improve the corrosion resistance of lead-free solder [12][13][14]. Han et al [15] added 0.01 wt.%, 0.03 wt.%, and 0.07 wt.% of Ni-CNTs, respectively, to Sn-Ag-Cu solder.…”

Section: Introductionmentioning

confidence: 99%

Effect of Ni-MOF Derivatives on the Electrochemical Corrosion Behavior of Sn-0.7Cu Solders

Lin

Gao

et al. 2022

Metals

View full text Add to dashboard Cite

The corrosion resistance of solder joints is a critical factor affecting the service life of electronic products during long-term operation. In this study, the corrosion behavior of Sn-0.7Cu-xNi@C (x = 0, 0.04, 0.08, and 0.12 wt.%) composite solders was investigated using a Tafel polarization curve in 3.5 wt.% NaCl solution, and the result demonstrated that it was the Ni@C that enhanced the corrosion resistance of the composite solder. The corrosion rate of the composite solders decreased with increasing Ni@C content and reached the lowest value of 0.205 mm/y when the content of Ni@C reached 0.08 wt.%. Ni@C changed the morphologies of corrosion products Sn3O(OH)2Cl2 from thick flakes to dense fine needles and flakes, which made it more difficult for Cl– to break down corrosion products. Thus, the corrosion resistance of composite solder was improved. The carbon skeleton in Ni@C served as an inert physical barrier to inhibit further corrosion. Furthermore, the potential difference between IMC and β-Sn decreased with the addition of Ni@C, which reduced the corrosion rate of the electric couple and enhanced the corrosion resistance of the composite solder.

show abstract

“…Therefore, research on the formation and growth of IMC layers in multiple reflows or thermal aging environments is essential [ 16 , 17 ]. In this regard, studies have been conducted to improve microstructures and mechanical properties by adding small amounts of trace elements to Sn-Cu solder with relatively high melting points [ 18 , 19 , 20 , 21 , 22 ]. The addition of trace elements can reduce the diffusion velocity of IMCs by lowering the activity of Cu and Su elements or by blocking the diffusion path of atoms in liquid–solid reaction conditions [ 23 , 24 ].…”

Section: Introductionmentioning

confidence: 99%

Effect of Multiple Reflows on the Interfacial Reactions and Mechanical Properties of an Sn-0.5Cu-Al(Si) Solder and a Cu Substrate

et al. 2021

View full text Add to dashboard Cite

In this study, the interfacial reactions and mechanical properties of solder joints after multiple reflows were observed to evaluate the applicability of the developed materials for high-temperature soldering for automotive electronic components. The microstructural changes and mechanical properties of Sn-Cu solders regarding Al(Si) addition and the number of reflows were investigated to determine their reliability under high heat and strong vibrations. Using differential scanning calorimetry, the melting points were measured to be approximately 227, 230, and 231 °C for the SC07 solder, SC-0.01Al(Si), and SC-0.03Al(Si), respectively. The cross-sectional analysis results showed that the total intermetallic compounds (IMCs) of the SC-0.03Al(Si) solder grew the least after the as-reflow, as well as after 10 reflows. Electron probe microanalysis and transmission electron microscopy revealed that the Al-Cu and Cu-Al-Sn IMCs were present inside the solders, and their amounts increased with increasing Al(Si) content. In addition, the Cu6Sn5 IMCs inside the solder became more finely distributed with increasing Al(Si) content. The Sn-0.5Cu-0.03Al(Si) solder exhibited the highest shear strength at the beginning and after 10 reflows, and ductile fracturing was observed in all three solders. This study will facilitate the future application of lead-free solders, such as an Sn-Cu-Al(Si) solder, in automotive electrical components.

show abstract

Effect of graphene nano-sheets additions on the density, hardness, conductivity, and corrosion behavior of Sn–0.7Cu solder alloy

Cited by 13 publications

References 41 publications

Nickel Nanoparticle/Carbon Films as an Interlayer To Improve the Stability of Solder Joints

Nickel Nanoparticle/Carbon Films as an Interlayer To Improve the Stability of Solder Joints

Effect of Ni-MOF Derivatives on the Electrochemical Corrosion Behavior of Sn-0.7Cu Solders

Effect of Multiple Reflows on the Interfacial Reactions and Mechanical Properties of an Sn-0.5Cu-Al(Si) Solder and a Cu Substrate

Contact Info

Product

Resources

About