Equipment 2006
DOI: 10.1615/ihtc13.p22.220
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Effect of Heat Spreading on the Performance of Heat Sink via Vapor Chamber

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“…The surface temperature distribution of the vapor chamber is more flattened than the conduction plates, as observed by Chen et al [24]. Therefore, the orthotropic approach will be a better way to present the heat-transfer behavior of the vapor chambers.…”
Section: Orthotropic Approachmentioning
confidence: 82%
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“…The surface temperature distribution of the vapor chamber is more flattened than the conduction plates, as observed by Chen et al [24]. Therefore, the orthotropic approach will be a better way to present the heat-transfer behavior of the vapor chambers.…”
Section: Orthotropic Approachmentioning
confidence: 82%
“…The simulations have been compared with the experimental results of Chen et al [19,24]. The watercopper vapor chamber used in this study has the outer size of 86 mm in length, 71 mm in width, and 5 mm in total thickness.…”
Section: Simulation Of the Integrated Heat Sinkmentioning
confidence: 99%
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