2006
DOI: 10.4028/www.scientific.net/kem.326-328.517
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Effect of High Glass Transition Temperature on Reliability of Non-Conductive Film (NCF)

Abstract: Among many factors that influence the reliability of a flip-chip assembly using NCF interconnections, the most effective parameters are often the coefficient of thermal expansion (CTE), the modulus (E), and the glass transition temperatures (Tg). Of these factors, the effect of Tg on thermal deformation and device reliability is significant; however, it has not been shown clearly what effect Tg has on the reliability of NCF. The Tg of a conventional NCF material is approximately 110°C. In this study, a new hig… Show more

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Cited by 5 publications
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“…The dimensions of the gold bumps in the chip plate were 120µm×120µm×18µm, and the peripheral bumps' pitches were all 130µm. The size of the PCB was 30×30×1.155mm (17) .…”
Section: Specimensmentioning
confidence: 99%
“…The dimensions of the gold bumps in the chip plate were 120µm×120µm×18µm, and the peripheral bumps' pitches were all 130µm. The size of the PCB was 30×30×1.155mm (17) .…”
Section: Specimensmentioning
confidence: 99%