2002
DOI: 10.1143/jjap.41.l1164
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Effect of High-Pressure Oxygen Annealing on Bi2SiO5-Added Ferroelectric Thin Films

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Cited by 30 publications
(14 citation statements)
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“…Ferroelectric SBT has advantages of a lower switching field and a lower leakage current in the form of ultrathin films [24,51,67]. However, the integration of SBT films into high-density memories is confronted with some problems, one being that the capacitors constructed to data suffer from low remanent polarization (P r ).…”
Section: ¼ 2: Srbi 2 Ta 2 O 9 -Based Single Crystalsmentioning
confidence: 99%
“…Ferroelectric SBT has advantages of a lower switching field and a lower leakage current in the form of ultrathin films [24,51,67]. However, the integration of SBT films into high-density memories is confronted with some problems, one being that the capacitors constructed to data suffer from low remanent polarization (P r ).…”
Section: ¼ 2: Srbi 2 Ta 2 O 9 -Based Single Crystalsmentioning
confidence: 99%
“…In addition, it was also reported that Bi 2 SiO 5 -addition in the preparation processes was effective for an improvement of fatigue characteristics in the case of Bi-layered ferroelectric films [2]. Recently, we focused on such previous works, and demonstrated that ferroelectric properties of Bi 4 À x Ln x Ti 3 O 12 (Ln¼La, Pr and Nd) bulks were significantly improved by adding Bi 2 SiO 5 or Bi 4 Si 3 O 12 [3][4][5][6][7].…”
Section: Introductionmentioning
confidence: 97%
“…Bismuth layer-structured ferroelectrics Bi 4 Ti 3 0 12 (BIT) thin film is expected for application to nonvolatile ferroelectric random access memory (NV -Fe RAM) devices with nondestructive readout operation due to its excellent fatigue endurance when in the deposition of this film with Pt electrode [1][2][3]. In recent years, preparation of BIT thin film has been investigated by several deposition techniques such as sol-gel [ 4,5] , metalorganic decomposition (MOD) [6,7], metalorganic chemical vapor deposition (MOCVD) [8][9][10][11][12][13][14] , and RF magnetron sputtering [I 5-2 I]. From the point of view of commercial production using sol-gel, MOD, and MOCVD methods, there are still some severe difficulties, for instance poor throughput (low deposition rate), high-temperature deposition, compositional nonuniformity across large substrate, rough surface morphology, lack of appropriate precursors in the gas phase, and poor reproducibility.…”
Section: Introductionmentioning
confidence: 99%