Effect of In Addition on Sn-3.5Ag Solder and Joint with Cu Substrate

Choi, Wooseok; Yoon, Seung Wook; Lee, Hyuck Mo

doi:10.2320/matertrans.42.783

Cited by 32 publications

(27 citation statements)

References 13 publications

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“…[5][6][7][8][9][10][11][12] Thus some defects of lead-free solder have been recently pointed out. These studies have found high reaction rates, especially the high dissolution rates of metals such as copper and iron in lead-free solder.…”

Section: Introductionmentioning

confidence: 99%

Effect of Iron Plating Conditions on Reaction in Molten Lead-Free Solder

et al. 2004

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To demonstrate the dissolution of plated iron in molten lead-free solder and the effect of iron-plating conditions on reactions in molten lead-free solder, the reaction test between Sn-3.0Ag-0.5Cu (mass%) solder and plated iron was performed. An Iron-plated copper plate, which was made by electroplating iron onto an oxygen-free copper substrate, was used as the test piece. The reaction test was carried out by using an oven in normal air. The solder was placed on the test piece and it was put into an oven held at 400, 430 and 460 C. The interface between the solder and plated iron was particularly examined. It was found that the intermetallic compound of FeSn 2 was formed at the interface regardless of the plating conditions. The results showed that the grain size of plated iron decreased with the increased current density and the dissolution thickness of plated iron in molten lead-free solder increased with the increased current density in the rack plating. In the barrel plating, the grain size was rather small in all the test pieces and the dissolution thickness was rather thick. Thus it has been made clear that the dissolution of plated iron in molten lead-free solder is attributable to the grain size of plated iron.

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Section: Introductionmentioning

confidence: 99%

Effect of Iron Plating Conditions on Reaction in Molten Lead-Free Solder

et al. 2004

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“…They reported that the microstructure of the solder and the morphology of secondary phases in the solder matrix changed accordingly. 14) In this study, the reaction between Sn-Ag solder added Co and metals such as plated iron and Cu was investigated in order to mainly clarify the effect of the addition of Co to SnAg solder on the dissolution of plated iron and the formation of intermetallic compound with a Cu substrate. …”

Section: Introductionmentioning

confidence: 99%

“…Concerning the addition of minor element to lead-free solder, the effect of minor elements such as In, Ni and Co has been explored to improve the properties of solder and interfacial reactions. [14][15][16][17][18] For example, Choi et al studied the effect of the addition of In on binary eutectic Sn-Ag solder. They reported that the microstructure of the solder and the morphology of secondary phases in the solder matrix changed accordingly.…”

Section: Introductionmentioning

confidence: 99%

“…[4][5][6][7][8][9][10][11] Especially, much research on Sn-Ag and Sn-Ag-Cu system solders has been carried out, and interfacial reactions between the solder and the substrate have been examined to obtain an understanding of their inter-reaction. Recently the high reaction rate of metals in molten lead-free solders, that is the high dissolution rate of metals in molten solders, is pointed out as the basic characteristics of lead-free solder and, however, the dissolution characteristics of metals in molten lead-free solders are not sufficiently clarified.…”

Section: Introductionmentioning

confidence: 99%

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Interfacial Reaction between Sn–Ag–Co Solder and Metals

2005

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In order to clarify the effect of the addition of Co to Sn-Ag solder on the interfacial reaction between solder and metals, the reaction between solder and metals, such as plated Fe and Cu, has been investigated. Sn-3.5 mass%Ag-xCo solders (x ¼ 0, 0.1, 0.3, 0.5 and 1.0 mass%) was specially prepared in this study. A reaction test between the solders and plated iron was performed at 723 K for 32.4 ks by using an oven in a normal air to mainly investigate the effect of the addition of Co to solder on the dissolution thickness of plated iron. And then a reaction test between solder and a Cu substrate was carried out to investigate the effect of the addition of Co to solder on the wettability of solder and the formation of intermetallic compound at the interface. For the reflow process, specimens were heated in a radiation furnace at 523 K for 60 s and, for the aging process, some specimens were heat-treated in an oil bath at 423 K for 168 h and 504 h. As a result of the reaction test between the solder and plated iron, it was found that the addition of Co to Sn-3.5Ag solder was certainly effective to reduce the dissolution thickness of plated iron. Then as a result of the reaction test using Cu substrate, it was clear that there was little effect of the addition of Co on the wettability of solder and Sn-3.5Ag solder added minor Co was certainly effective to reduce the growth rate of the intermetallic compound at the aging process.

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“…The IMC grains are mostly hemi-spherical or scallop-shaped and their surfaces are rough (rounded) on Cu while it is polyhedralshaped and faceted on Ni. [1][2][3][4][5][6] According to the classical solidification theory of unary materials proposed by Jackson, 7) the geometry of the surface that separates two types of atoms of liquid and solid may be faceted or meandering (rough), which is highly correlated with the Jackson's parameter. The Jackson's parameter of the crystal with a rough surface is smaller than 2 while it is larger than 2 for faceted grains.…”

Section: Introductionmentioning

confidence: 99%

Abnormal Grain Growth of Ni<SUB>3</SUB>Sn<SUB>4</SUB> at Sn-3.5Ag/Ni Interface

2004

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By the reaction of molten solder alloy with compositions of 96.5Sn-3.5Ag (compositions are all in weight percent unless specified otherwise) with either the thick Cu or the thick Ni substrate at 250 C, the rounded Cu 6 Sn 5 grains formed over Cu and the faceted Ni 3 Sn 4 grains precipitated over Ni. As the soldering time changed from 1 min to 60 min, normal grain growth occurred for rounded Cu 6 Sn 5 grains while abnormal grain growth (AGG) mode was observed for faceted Ni 3 Sn 4 grains. The measured grain size distributions also confirmed the difference between normal grain growth and abnormal grain growth.

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Effect of In Addition on Sn-3.5Ag Solder and Joint with Cu Substrate

Cited by 32 publications

References 13 publications

Effect of Iron Plating Conditions on Reaction in Molten Lead-Free Solder

Effect of Iron Plating Conditions on Reaction in Molten Lead-Free Solder

Interfacial Reaction between Sn–Ag–Co Solder and Metals

Abnormal Grain Growth of Ni<SUB>3</SUB>Sn<SUB>4</SUB> at Sn-3.5Ag/Ni Interface

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Effect of In Addition on Sn-3.5Ag Solder and Joint with Cu Substrate

Cited by 32 publications

References 13 publications

Effect of Iron Plating Conditions on Reaction in Molten Lead-Free Solder

Effect of Iron Plating Conditions on Reaction in Molten Lead-Free Solder

Interfacial Reaction between Sn&ndash;Ag&ndash;Co Solder and Metals

Abnormal Grain Growth of Ni<SUB>3</SUB>Sn<SUB>4</SUB> at Sn-3.5Ag/Ni Interface

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Interfacial Reaction between Sn–Ag–Co Solder and Metals