Effect of In Addition on Microstructure, Wettability and Strength of SnCu Solder

Nabihah, A. B.; Sharif, Nurulakmal Mohd

doi:10.1016/j.matpr.2019.06.366

Cited by 10 publications

(4 citation statements)

References 14 publications

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“…Shear strength for solder alloy with 0.3 Wt.% Cu (orange) increased dramatically from 0 h until 500 h; nevertheless, the thermal aging leads to a decrement at 1,000 h and then increase slightly at 2,000 h. Therefore, the decrease in shear strength observed in the current aged specimens can reasonably be attributed to an increased thickness of the brittle IMC layer, the agglomeration of (Ni,Cu) 3 Sn 4 compounds or a coarsening of the Ag 3 Sn particles. Nabihah and Nurulakmal (2019) have reported the same pattern in their work on where the strength of solder joints can be significantly decreased by the brittle Ag 3 Sn phase. As displayed in Figure 6 for 0.5 Wt.% Cu (grey), the shear strength before the 1,000 h of thermal storage keeps increasing significantly until it reaches maximum value of 10 MPa, but at 2,000 h, it drops slightly.…”

Section: Single-lap Solder Joint Shear Strengthsupporting

confidence: 55%

“…Tin-lead (Sn-Pb) solders have been widely used in electronic industry due to a combination of many advantages, such as low melting temperature, economically affordable and excellent wettability (Nabihah and Nurulakmal, 2019). Despite all of these advantages, a rapid switch to Pb-free solders has occurred to replace the toxic Pb-based solder in the packaging process of electronic devices and components.…”

Section: Introductionmentioning

confidence: 99%

“…This alloy has many benefits compared to Sn-Pb eutectic alloy; it has good manufacturability, good mechanical properties and stable interfaces with most metallic substrates and surface finishes, as well as non-toxic. Nevertheless, Sn-0.7Cu solder has been proposed as one of the most promising substitutes for lead-containing solder wave, dip and iron soldering process with inexpensive and good electrical conductivity along with melting temperature of 227°C (Nabihah and Nurulakmal, 2019).…”

Section: Introductionmentioning

confidence: 99%

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Role of Cu percentage in the Sn-xCu alloy on the mechanical performance at Sn-xCu/ENIG interface produced by laser soldering

Abdullah

Idris

2023

SSMT

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Purpose Pb-free solders have been developed to replace the standard Sn–Pb eutectic solder since the prohibition on Pb used in solders. The Sn–Ag–Cu series of lead-free solders is the most extensively used in the electronics industry. The Ag3Sn, which forms during isothermal ageing, can significantly degrade solder joint reliability. Sn–Ag–Cu solder’s high price further hindered its use in the electronics industry. This paper aims to investigate different copper percentages into Sn–xCu solder alloy to improve its microstructure and strength performance. Design/methodology/approach The solder alloys used in this work were Sn–xCu, where x = 0.0, 0.3, 0.5, 0.7, 1.0 Wt.%, which was soldered onto electroless nickel immersion gold (ENIG) substrate using carbon dioxide (CO2) gas laser. Then these samples were subjected to isothermal aging for 0, 200, 500, 1,000 and 2,000 h. The Sn–xCu solder alloy was fabricated through a powder metallurgy process. Findings Microstructure characterization showed that Cu addition resulted in fine and rounded shape of Cu–Sn–Ni particles. Shear strength of Sn–xCu solder joints was increased with increasing Cu content, but at aging duration of 1,000 h, it dropped slightly. It is believed that the strength improved due to the increment of diffusion rate during isothermal aging. Practical implications In a Cu–Sn solder, the recommended amount is 1.0 Wt.% of Cu. In extensive aging procedures, it was discovered that Sn1.0Cu solder improved the reliability of solder joints. The findings indicated that the innovative solder alloys might satisfy the needs of high-reliability applications. Originality/value The study shows that the right amount of Cu enhances the solidification of Sn–Cu solder, increasing the shear force of the Cu–Sn solder joint. The Sn1.0Cu exhibits a ductile fracture on the top microstructure, improving the joint’s average shear strength.

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Section: Single-lap Solder Joint Shear Strengthsupporting

confidence: 55%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Role of Cu percentage in the Sn-xCu alloy on the mechanical performance at Sn-xCu/ENIG interface produced by laser soldering

Abdullah

Idris

2023

SSMT

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“…Moreover, it was reported that the In addition to Sn-Ag solder effectively reduced the formation of large Ag 3 Sn plates but promoted the formation of irregular polygonal Ag 9 In 4 instead [14]. It was also found that the addition of In could refine the microstructure of solder and improve its strength [15,16]. Moreover, Wang et al investigated the interfacial reaction between Sn-1.8Ag-9.4In solder and Cu substrate and found that Cu 6 (Sn,In) 5 and Cu 3 (Sn,In) were formed at the interface after reflow [17].…”

Section: Introductionmentioning

confidence: 99%

Characterization of Sn-xIn Solders and Thermomigration-Induced Interfacial IMC Growth of Cu/Sn-xIn/Cu Micro Solder Joints

Qiao

Ren

et al. 2023

Electronics

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The melting behavior and microstructure of bulk Sn-xIn (x = 6, 12 and 24, wt.%) solders and the thermomigration, elemental distribution and intermetallic compound (IMC) growth in Cu/Sn-xIn/Cu micro solder joints during soldering and aging under temperature gradient (TG) were investigated. The results indicate that In addition effectively decreased the melting temperature of the bulk solders. Only the InSn4 phase was detected when In addition was increased to 24 wt.%. During soldering under TG, the growth rate of the interfacial IMC layer at the cold end interfaces gradually decreased as the In content increased. The mechanism of microstructure evolution and elemental distribution in the micro solder joints was revealed based on the TG-induced atomic thermomigration (TM). The chemical potential gradient of atoms was enhanced by TM, and the rapid diffusion of atoms in the liquids resulted in a uniform distribution of In element in both solders and the IMC phase during soldering. While during aging under TG, there was a smaller chemical potential gradient due to the slow atomic diffusion rate. At this time, TG dominated the atomic migration, which resulted in a nonuniform distribution of the In element in the whole joints. This study provides further insight into the application of In-containing solders in electronic packaging.

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Interfacial reaction and properties of Sn/Cu solder reinforced with graphene nanosheets during solid–liquid diffusion and reflowing

Gao

Zhang

et al. 2021

J Mater Sci: Mater Electron

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Effect of In Addition on Microstructure, Wettability and Strength of SnCu Solder

Cited by 10 publications

References 14 publications

Role of Cu percentage in the Sn-xCu alloy on the mechanical performance at Sn-xCu/ENIG interface produced by laser soldering

Role of Cu percentage in the Sn-xCu alloy on the mechanical performance at Sn-xCu/ENIG interface produced by laser soldering

Characterization of Sn-xIn Solders and Thermomigration-Induced Interfacial IMC Growth of Cu/Sn-xIn/Cu Micro Solder Joints

Interfacial reaction and properties of Sn/Cu solder reinforced with graphene nanosheets during solid–liquid diffusion and reflowing

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