Interfacial reaction and properties of Sn/Cu solder reinforced with graphene nanosheets during solid–liquid diffusion and reflowing

Li, Mulan; Gao, Lili; Zhang, Liang; Jiang, Nan; Zhong, Shengwen; Zhang, Lei

doi:10.1007/s10854-021-07044-5

Cited by 4 publications

(2 citation statements)

References 24 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The development of electrodeposited Sn-GO composite coatings has shown promising electrochemical performance related to various industrial applications, such as corrosion protection, electronics fabrication or anode material for lithium-ion batteries [28,30]. In addition, the incorporation of graphene-related materials into Sn and Sn alloys acting as lead-free solders (i.e., SnAgCu, SnBi, SnZn and SnIn) facilitated an improvement of their wetting property, but an insignificant change in their melting point [31][32][33][34]. Table 1 briefly presents the main results from previous reports regarding the electrodeposition of Sn and Sn alloy composites with graphene related materials involving aqueous electrolytes.…”

Section: Introductionmentioning

confidence: 99%

Electrodeposition of Tin-Reduced Graphene Oxide Composite from Deep Eutectic Solvents Based on Choline Chloride and Ethylene Glycol

Costovici

Pantazi

Balan

et al. 2023

Metals

View full text Add to dashboard Cite

Some experimental results regarding the direct electrodeposition of tin-reduced graphene oxide composite (Sn-rGO) compared to the electrodeposition of tin metal (Sn) from a deep eutectic solvent (DES), namely using choline chloride-ethylene glycol eutectic mixtures, are presented. Raman spectroscopy demonstrated that GO is also reduced during the tin electrodeposition. Scanning electron microscopy (SEM) confirmed the presence of incorporated graphene related material in the composite film. X-ray diffraction patterns showed that the presence of rGO in the deposit diminished preferred orientation of Sn growth along the planes (101), (211), (301), and (112). The analysis of current-time transients involving Scharifker & Hills model has shown that Sn-rGO composite deposition process corresponds to a nucleation and tridimensional growth controlled by diffusion, with nucleation evolving from progressive to instantaneous upon increasing the overpotential. Diffusion coefficients at 25 °C of 9.4 × 10−7 cm2 s−1 for Sn(II) species in the absence and of 14.1 × 10−7 cm2 s−1 in the presence of GO, were determined. The corrosion performance has been assessed through the analysis of the recorded potentiodynamic polarization curves and of the electrochemical impedance spectra during continuous immersion in aerated 0.5 M NaCl aqueous solution at 25 °C for 144 h. A slight improvement of the corrosion performance in the case of the Sn-rGO composite coatings was noticed, as compared to pure Sn ones. Furthermore, the solderability performance has been evaluated. The solder joints showed a proper adhesion to the substrate with no fractures, and wetting angles around 44° have been determined, suggesting adequate solderability characteristics.

show abstract

Section: Introductionmentioning

confidence: 99%

Electrodeposition of Tin-Reduced Graphene Oxide Composite from Deep Eutectic Solvents Based on Choline Chloride and Ethylene Glycol

Costovici

Pantazi

Balan

et al. 2023

Metals

View full text Add to dashboard Cite

show abstract

“…In the Sn-Cu solder alloy, graphene is attached to the Cu surface as a barrier layer. It inhibits the growth of the intermetallic compound layer by hindering the diffusion of Cu atoms [85].…”

Section: Sn-cu Composite Soldermentioning

confidence: 99%

A Review on the Development of Adding Graphene to Sn-Based Lead-Free Solder

Yu²,

et al. 2023

Metals

View full text Add to dashboard Cite

In the electronics industry, graphene is applied with modified lead-free solder. This review presents advances in the preparation, strengthening mechanisms, and property characterization of graphene composite solders. Graphene composite solders are divided into two main categories: unmodified graphene and metal-particle-modified graphene. The unmodified graphene composite solders are classified according to the different solder systems. Metal-particle-modified graphene composite solders are classified according to different metal particles. However, there are still challenges with graphene composite solders. The main challenge is the poor bonding of graphene to the substrate and the nonuniform dispersion. Future directions for the development of graphene composite solders are proposed. They can provide some reference for the development of new graphene composite solders in the future.

show abstract

Influence behavior and mechanism of crystal orientation of Cu6Sn5 coating on interfacial intermetallic compounds growth in Sn-0.7Cu/Cu solder joint

Zhang,

Qu,

et al. 2024

Materials Characterization

View full text Add to dashboard Cite

Interfacial reaction and properties of Sn/Cu solder reinforced with graphene nanosheets during solid–liquid diffusion and reflowing

Cited by 4 publications

References 24 publications

Electrodeposition of Tin-Reduced Graphene Oxide Composite from Deep Eutectic Solvents Based on Choline Chloride and Ethylene Glycol

Electrodeposition of Tin-Reduced Graphene Oxide Composite from Deep Eutectic Solvents Based on Choline Chloride and Ethylene Glycol

A Review on the Development of Adding Graphene to Sn-Based Lead-Free Solder

Influence behavior and mechanism of crystal orientation of Cu6Sn5 coating on interfacial intermetallic compounds growth in Sn-0.7Cu/Cu solder joint

Contact Info

Product

Resources

About