“…Aluminum, being lighter, has a high specific thermal conductivity, which makes it the leading matrix material for heat sink composites in automotive and aerospace electronics, and also in portable electronic devices [ 101 , 102 , 103 , 104 , 105 , 106 ]. However, the high coefficient of thermal expansion (~23 × 10 −6 K −1 ) of aluminum is compensated by reinforcement with carbides (SiC [ 33 , 101 , 107 , 108 , 109 , 110 , 111 , 112 ], B 4 C [ 105 ]), nitride (BN [ 107 , 113 ], Si 3 N 4 [ 114 ], AlN [ 111 , 115 ]), oxides (Al 2 O 3 [ 107 ]), diamond [ 102 , 106 , 116 , 117 , 118 , 119 , 120 , 121 , 122 , 123 , 124 , 125 , 126 ], graphite flakes [ 68 , 127 , 128 , 129 ], and carbon fibers [ 39 , 130 , 131 , 132 , 133 ].…”