Effect of Interfacial Reaction on Joint Strength of Semiconductor Metallization and Sn-3Ag-0.5Cu Solder Ball

Abstract

Semiconductor packages that use metallization and lead-free solders are increasingly being used in electronic products. In this study, interface reactions and joint-strength reliability were investigated for Sn-3W%Ag-0.5W%Cu solder ball joints joined to Cr/Cu and Cr/Ni-40W% metallization layers that were heat treated at 260°C. The strength of the joint with the Cr/Cu metallization layer decreased as the duration of the heat treatment increased. Sn and Cr interface reactive layers were generated after the loss of Cu in the Cr/Cu metallization layer, but the connection was maintained. By contrast, the connection of the joint to the Cr/Ni-40W metallization layer was relatively stable under the heat treatment conditions investigated.

Development of high reliability lead-free solder joint dispersed IMC pillar

“…[1] Sn-Ag-Cu lead-free solder such as Sn-3.0Ag-0.5Cu (mass%) has been spread in various electronics products as the substitute of SnPb eutectic solder. [2][3][4] For automotive applications, similar request has been also required. In the case of packaging substrates used in automotive products such as power modules, a high-reliable relatively large joint area is required.…”

Effect of Added Elements on Microstructures and Joint Strength of Lead-Free Sn-Based Solder Joint Dispersed IMC Pillar

“…As triggered by RoHS restriction in EU, many studies on lead-free solder have been conducted all over the world [1]. Sn-Ag-Cu lead-free solder such as Sn-3.0Ag-0.5Cu (mass%) has been spread in various electronics products as the substitute of Sn-Pb eutectic solder [2][3][4]. For automotive applications used under severe conditions, the use of lead-free solder has been also required.…”