2012
DOI: 10.1007/s11664-012-2223-2
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Effect of Isothermal Aging and Electromigration on the Microstructural Evolution of Solder Interconnections During Thermomechanical Loading

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Cited by 7 publications
(2 citation statements)
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“…When we now take Fick's law, Equations (16) and 17, we arrive at a general relation between the intrinsic and tracer diffusion coefficients:…”
Section: Kinetic Considerationsmentioning
confidence: 99%
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“…When we now take Fick's law, Equations (16) and 17, we arrive at a general relation between the intrinsic and tracer diffusion coefficients:…”
Section: Kinetic Considerationsmentioning
confidence: 99%
“…Further, it provides simple means to assess, for example, the effect of current flow on the evolution of interfacial reaction layer growth or how alloying elements may change the kinetics of phase growth kinetics. 16 It is frequently found out that when dealing with diffusion in ternary or even higher-order systems the mathematics becomes very complicated and the physical picture of the phenomena 74 T. LAURILA AND A. PAUL under investigation may be blurred or disappears totally. 17 It will be shown below that the thermodynamic kinetic method can be used to greatly simplify the analyses and bring back the physics to the phenomena under investigation.…”
Section: Introductionmentioning
confidence: 99%