2002
DOI: 10.1016/s0921-4526(02)01278-4
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Effect of isothermal annealing on CdTe and the study of electrical properties of Au–CdTe Schottky barriers

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Cited by 20 publications
(5 citation statements)
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“…The experimental data for the Au concentration distributions in CdTe films, as is seen from figure 2, are sufficiently approximated by the theoretical curve, which is characteristic for impurity diffusion from thin layer [9] N(x, t) = Q/(πDt) 0.5 exp(−x 2 /4Dt), (5) where N(x, t) is the impurity concentration. It should be noted that the Au concentration profile for high temperature 550 • C somewhat differs from relation (5). It can be caused by partial evaporation of components of CdTe, accompanied by an increase in vacancy concentration.…”
Section: Resultsmentioning
confidence: 64%
See 1 more Smart Citation
“…The experimental data for the Au concentration distributions in CdTe films, as is seen from figure 2, are sufficiently approximated by the theoretical curve, which is characteristic for impurity diffusion from thin layer [9] N(x, t) = Q/(πDt) 0.5 exp(−x 2 /4Dt), (5) where N(x, t) is the impurity concentration. It should be noted that the Au concentration profile for high temperature 550 • C somewhat differs from relation (5). It can be caused by partial evaporation of components of CdTe, accompanied by an increase in vacancy concentration.…”
Section: Resultsmentioning
confidence: 64%
“…The heat treatment of Au/CdTe contacts can be accompanied by a change in the structure and the characteristics of CdTe films and Au/CdTe contacts due to the diffusion penetration of Au into CdTe substrate. The effect of the thermal annealing and the surface treatment on the change in the electrical characteristics of Au/nCdTe Schottky barriers prepared on the base of CdTe single crystal substrates has been reported [5,6]. To our knowledge, data on the Au diffusion in the CdTe films has been presented only in one work [7].…”
Section: Introductionmentioning
confidence: 99%
“…In the case of TE, saturation current I s is given by, 12 where A is the device area, A * is the Richardson's constant and φ b is the barrier height. The values of diode ideality factor, n, were determined from the slope of Fig.…”
Section: Structure and Current-voltage (I-v) Characteristicsmentioning
confidence: 99%
“…Isolating moisture-sensitive substances from exposure to water vapor, a process which can effectively enhance their lifetime, is greatly needed in many applications such as metal anti-corrosion, 1 electronic packaging, 2,3 food packaging 4 and cultural relic protection. 5 Polymer barrier materials have been increasingly used in these applications due to their excellent mechanical exibility, low stress, low cost and the ease of processing. For example, one of the commonly used polymer barrier materials is poly(chloro-p-xylylene) (PPXC), which can be conformed onto a desirable protected substrate by chemical vapor deposition (CVD) polymerization of chloro-p-xylylene.…”
Section: Introductionmentioning
confidence: 99%