2018
DOI: 10.1063/1.5049298
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Effect of laser parameters and post-texturing treatments on the optical and electrical properties of laser textured c-Si wafers

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Cited by 7 publications
(3 citation statements)
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“…In conjunction with that, more light is trapped at a high pulsed laser power of 102 W due to more depth holes being created to shorten carriers' travel. Laser texturization on Si wafers shows a significantly low reflectance that significantly increases the absorption of incident solar radiation [28], [29].…”
Section: Resultsmentioning
confidence: 99%
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“…In conjunction with that, more light is trapped at a high pulsed laser power of 102 W due to more depth holes being created to shorten carriers' travel. Laser texturization on Si wafers shows a significantly low reflectance that significantly increases the absorption of incident solar radiation [28], [29].…”
Section: Resultsmentioning
confidence: 99%
“…The fundamental properties of carbon in n-Si can be used to quickly identify the root cause of the contamination in production environment which is also comes from melted silicon from laser texturing at high power. Carbon distribution and precipitation on Si comes from unknown reaction rate in the Si melt [28]. Furthermore, laser texturing enhances solar cell efficiency by improving light trapping and reducing recombination, outperforming traditional methods, especially when combined with potassium hydroxide etching, while ultrafast laser processing shows promise in advancing photovoltaics, albeit with ongoing research needed for hyperdoping [28], [40], [43]- [45].…”
Section: Figure 6 Ir Transmission On (A) 1 MM (B) 2 Mm (C) 3 Mm (D) 4...mentioning
confidence: 99%
“…The most common application of laser technology is scribing thinfilm solar cells to generate large-scale and series-connected photovoltaic modules (Gupta and Carlson 2015). Laser is also used in the edge isolation process (Singh et al 2014), selective emitter formation (Victor et al 2015), doping (Tomizawa et al 2016), all-lasertransferred contact (ALTC) (Wang et al 2015), drilling (Zhang et al 2016) and surface modification (Radfar et al 2018).…”
Section: Introductionmentioning
confidence: 99%