2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT) 2018
DOI: 10.1109/iemt.2018.8511685
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Effect of Lead Frame and Mold Tool Dimension and Tolerance on Lead Burr in Cavity Encapsulation

Clemen Jose Abrena Regua1,
Lee Chai Chee2,
Chong Chee Chiew3
et al.
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